Method for manufacturing semiconductor device

ABSTRACT

It is an object to provide a method of manufacturing a crystalline silicon device and a semiconductor device in which formation of cracks in a substrate, a base protective film, and a crystalline silicon film can be suppressed. First, a layer including a semiconductor film is formed over a substrate, and is heated. A thermal expansion coefficient of the substrate is 6×10 −7 /° C. to 38×10 −7 /° C., preferably 6×10 −7 /° C. to 31.8×10 −7 /° C. Next, the layer including the semiconductor film is irradiated with a laser beam to crystallize the semiconductor film so as to form a crystalline semiconductor film. Total stress of the layer including the semiconductor film is −500 N/m to +50 N/m, preferably −150 N/m to 0 N/m after the heating step.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for manufacturing asemiconductor device having a semiconductor element over a substratewith an insulating film therebetween.

2. Description of the Related Art

As a conventional method for manufacturing a polycrystallinesemiconductor used for a thin film device such as an insulated-gatefield-effect transistor, there is a method which employs a laserannealing method (for example, see Patent Document 1: Japanese PublishedPatent Application No. H 5-182923). Specifically, a silicon oxide filmwhich is a base protective film is formed over a glass substrate, and anamorphous silicon film is formed over the silicon oxide film.Subsequently, heat annealing is performed to reduce the concentration ofhydrogen contained in the amorphous silicon film, and a KrF excimerlaser beam is irradiated onto the amorphous silicon film to crystallizethe amorphous silicon film, thereby forming a polycrystalline siliconfilm.

SUMMARY OF THE INVENTION

However, in a case where the above-described laser annealing method isused, there is a problem in that when the power of the laser beam ishigh, a crack may form in the substrate, the base protective film, orthe crystalline silicon film. Consequently, the yield of semiconductordevices having the thin film device is reduced.

Therefore, an object of the present invention is to provide a method formanufacturing a crystalline silicon film and a method for manufacturinga semiconductor device in which the formation of a crack in a substrate,a base protective film, and a crystalline silicon film can besuppressed.

In the present invention, a layer including a semiconductor film isformed over a substrate which has a thermal expansion coefficient ofgreater than 6×10⁻⁷/° C. and less than or equal to 38×10⁻⁷/° C.,preferably greater than 6×10⁻⁷/° C. and less than or equal to31.8×10⁻⁷/° C., and the layer is heated. Next, the heated layer isirradiated with a laser beam to crystallize the semiconductor film,thereby forming a crystalline semiconductor film. Stress of the layerincluding the semiconductor film, which is formed over the substrate,may be tensile stress or compressive stress after it is formed, asappropriate. However, as the layer including the semiconductor film, alayer whose total stress (stress integrated in a film thicknessdirection) after the above-mentioned heating is −500 N/m to +50 N/m,inclusive, preferably −150 N/m to 0 N/m, inclusive, is formed.

When the layer formed over the substrate which has a thermal expansioncoefficient of greater than 6×10⁻⁷/° C. and less than or equal to38×10⁻⁷/° C., preferably greater than 6×10⁻⁷/° C. and less than or equalto 31.8×10⁻⁷/° C., is irradiated with the laser beam, energy of thelaser beam which is irradiated onto the layer reaches a surface of thesubstrate, and an irradiation part of the laser beam and also thesubstrate surface located in the vicinity thereof are heated. Directlybelow the irradiation part of the laser beam, the transmissibility ofthe energy of the laser beam is high, so the substrate surface softens.Further, in the vicinity of the irradiation part of the laser beam, thesubstrate surface is heated and its volume expands, so compressivestress occurs. Meanwhile, outside the region where compressive stresshas occurred, tensile stress occurs as a reaction to the compressivestress.

When the laser beam moves, the softened substrate surface also graduallycools and its volume contracts, so tensile stress occurs. Meanwhile, inthe vicinity of the irradiation part of the laser beam, the heatedsubstrate surface cools to room temperature. However, compressive stressremains. Due to the difference between the tensile stress and thecompressive stress, a heat distortion remains in the substrate. If thisheat distortion becomes larger than the rupture stress of the substrate,a crack forms in the substrate, and a crack also forms in the layerformed over the substrate surface. However, by forming a layer includinga semiconductor film whose total stress after being heated is −500 N/mto +50 N/m, inclusive, preferably −150 N/m to 0 N/m, inclusive, over thesubstrate, the heat distortion which is generated in the substratesurface can be eased. As a result, the number of cracks in the substrateand the layer formed over the substrate can be reduced.

As the layer including a semiconductor film which is formed over thesubstrate surface, a layer having a film thickness and a film stresssuch that after being heated the layer has a total stress in the rangeof −500 N/m to +50 N/m, inclusive, preferably −150 N/m to 0 N/m,inclusive, is formed.

Here, given that the film stress of each layer included in the layerincluding a semiconductor film contributes to linearity with respect tothe total stress, if the stress of each layer is a and the filmthickness of each layer is d, the total stress S is approximatelycalculated by the mathematical formula below. Therefore, even if thereis a layer in which tensile stress is generated in the layers includedin the layer including a semiconductor film, if compressive stress isgenerated in another layer, the total stress of the layer including asemiconductor film after being heated can be in the range of −500 N/m to+50 N/m, inclusive, preferably −150 N/m to 0 N/m, inclusive.

$\begin{matrix}{S = {\sum\limits_{i}{\sigma_{i}d_{i}}}} & \left\lbrack {{Mathematical}\mspace{14mu} {Formula}\mspace{20mu} 1} \right\rbrack\end{matrix}$

By forming a layer whose total stress after being heated is −500 N/m to+50 N/m, inclusive, preferably −150 N/m to 0 N/m, inclusive, over asubstrate whose thermal expansion coefficient is greater than 6×10⁻⁷/°C. and less than or equal to 38×10⁻⁷/° C., preferably greater than6×10⁻⁷/° C. and less than or equal to 31.8×10⁻⁷/° C., the formation ofcracks in the substrate and the layer formed over the substrate when thelayer formed over the substrate is irradiated with a continuous wavelaser beam or a pulsed laser beam having a frequency of 10 MHz or morecan be suppressed. That is, when the layer is irradiated with the laserbeam, energy of the laser beam reaches the substrate, and in a part ofthe substrate having a thermal expansion coefficient of greater than6×10⁻⁷/° C. and less than or equal to 38×10⁻⁷/° C., preferably greaterthan 6×10⁻⁷/° C. and less than or equal to 31.8×10⁻⁷/° C., a heatdistortion is generated as a result of the heating by the laser beamirradiation and cooling. Due to the heat distortion, tensile stress isgenerated in a part of the substrate surface. However, since a layerhaving compressive stress is formed over the substrate, the tensilestress of the substrate surface can be eased. Therefore, the formationof cracks in the substrate and the layer can be suppressed. As a result,the number of defective semiconductor devices can be reduced, and yieldcan be improved.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A to 1D illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIGS. 2A to 2I are top views of substrates showing when a semiconductorfilm has been irradiated with a laser beam, and graphs showing thetemperature distributions of the substrates and the stress of thesubstrate surfaces.

FIG. 3 shows an outline of a laser irradiation apparatus which can beapplied to the invention.

FIGS. 4A to 4D illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIGS. 5A to 5C illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIGS. 6A to 6C illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIGS. 7A to 7E illustrate cross-sectional views of structures of a lightemitting element that can be applied to the invention.

FIG. 8 illustrates an equivalent circuit of a light emitting elementthat can be applied to the invention.

FIGS. 9A to 9E illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIGS. 10A to 10D illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIGS. 11A to 11C illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIGS. 12A to 12D illustrate cross-sectional views of a method ofmanufacturing a semiconductor device of the invention.

FIG. 13 illustrates a structure of a semiconductor device of theinvention.

FIGS. 14A to 14F illustrate uses of a semiconductor device of theinvention.

FIGS. 15A to 15F illustrate electronic devices which employ asemiconductor device of the invention.

FIG. 16 illustrates a structure of an electronic device which employs asemiconductor device of the invention.

FIG. 17 is a development view illustrating an electronic device whichemploys a semiconductor device of the invention.

FIGS. 18A and 18B are top views illustrating a semiconductor device ofthe invention.

FIG. 19 is a graph showing the thermal expansion coefficient ofsubstrates used in an embodiment.

FIGS. 20A to 20C are cross-sectional views illustrating structures of alayer including a semiconductor film, which is over a substrate, whichare used in an embodiment.

FIG. 21 is a graph showing total stress calculated from the film stressof single films.

FIG. 22 is a graph showing total stress calculated from the film stressof single films.

FIG. 23 is a graph showing the total stress of layers including asemiconductor film which are formed over substrates.

FIG. 24 is a graph showing the generation of cracks when layersincluding a semiconductor film which are formed over substrates wereirradiated with a laser beam.

FIGS. 25A to 25C illustrate a method of calculating stress, and stress.

FIG. 26 is a graph showing results of a temperature simulation of asubstrate.

DETAILED DESCRIPTION OF THE INVENTION

Embodiment modes of the invention will be described below, withreference to the drawings. However, the invention can be carried out inmany different modes, and it will be readily apparent to those skilledin the art that various changes can be made to the modes and detailsdescribed herein without departing from the spirit and scope of theinvention. Therefore, the invention should not be construed as beinglimited to the description of the embodiment modes.

Embodiment Mode 1

As shown in FIG. 1A, over one surface of a substrate 100 having aninsulating surface, insulating films 101 and 102 which serve as baseprotective films are formed, and an amorphous semiconductor film 103 isformed over the insulating film 102. Next, in order to remove hydrogenof the amorphous semiconductor film, the amorphous semiconductor film isheated. At this time, the substrate and the insulating films which serveas base protective films are also heated. The insulating films 101 and102 which serve as base protective films and the amorphous semiconductorfilm 103 are formed such that the total stress of the insulating films101 and 102 and the amorphous semiconductor film 103 after the heatingis −500 N/m to +50 N/m, inclusive, preferably −150 N/m to 0 N/m,inclusive.

As the substrate 100 having an insulating surface, a substrate which hasa thermal expansion coefficient of greater than 6×10⁻⁷/° C. and lessthan or equal to 38×10⁻⁷/° C., preferably greater than 6×10⁻⁷/° C. andless than or equal to 31.8×10⁻⁷/° C., is used. As representativeexamples of a substrate having a thermal expansion coefficient ofgreater than 6×10⁻⁷/° C. and less than or equal to 38×10⁻⁷/° C.,preferably greater than 6×10⁻⁷/° C. and less than or equal to31.8×10⁻⁷/° C., an AN100 substrate (manufactured by Asahi Glass Co.,Ltd), an EAGLE2000 substrate (manufactured by Corning, Inc.), and thelike can be given. Further, as the substrate 100 having an insulatingsurface, a substrate with a thickness of 0.5 mm to 1.2 mm, inclusive,can be used. Here, for example, an AN100 glass substrate with athickness of 0.7 mm is used.

Subsequent to forming the insulating films 101 and 102 and the amorphoussemiconductor film 103 over one surface of the substrate, heat treatmentmay be conducted at a temperature at which the hydrogen contained in theamorphous semiconductor film can be removed. Further, during the heattreatment, hydrogen contained in the insulating films 101 and 102 whichserve as base protective films may also be removed. By removing thehydrogen contained in the amorphous semiconductor film, emission ofhydrogen from the amorphous semiconductor film when the amorphoussemiconductor film is subsequently irradiated with a laser beam can beavoided, and the tolerance of the film irradiated with the laser beamcan be improved. Concerning such heating conditions, heating can beconducted using an annealing furnace at a temperature of 500° C. to 550°C., inclusive, for one to ten hours, inclusive, preferably one to fivehours, inclusive. Alternatively, heating can be conducted using a rapidthermal annealing method (an RTA method) at a temperature of 550° C. to750° C., inclusive, preferably 600° C. to 650° C., inclusive, for fromone second to ten minutes, preferably from three minutes to eightminutes.

Further, instead of the above-described heat treatments, a heattreatment which crystallizes the amorphous semiconductor film may beconducted. In that case, the heat treatment may be conducted afterdoping the amorphous semiconductor film with a metal element thatpromotes crystallization, or the like. Representatively, by doping theamorphous semiconductor film with a very small amount of a metal elementsuch as nickel, palladium, germanium, iron, tin, lead, cobalt, platinum,copper, or gold, and subsequently conducting the heat treatment, acrystalline semiconductor film can be formed.

Here, in order to remove hydrogen contained in the amorphoussemiconductor film and hydrogen contained in the insulating films 101and 102 which serve as base protective films, heating is conducted at650° C. for six minutes.

As the insulating films 101 and 102 which serve as base protectivefilms, a film including a compound, such as a silicon oxide film, asilicon nitride film, a silicon oxynitride film, a silicon nitride oxidefilm, an aluminum nitride film, an aluminum oxynitride film, or analumina film, or a film including an aforementioned compound whichcontains hydrogen, or the like can be used.

Note that here, a silicon oxynitride film refers to a film whichcontains 1.8 to 2.3 times as much oxygen as silicon, preferably 1.92 to2.16 times as much oxygen as silicon. Further, the film may contain0.001 to 0.05 times as much nitrogen as silicon, preferably 0.001 to0.01 times as much nitrogen as silicon. Furthermore, the film maycontain hydrogen at a proportion of 0.01 to 0.3 times as much hydrogenas silicon, preferably 0.04 to 0.24 times as much hydrogen as silicon.Moreover, the film may contain carbon at a proportion of 0.0 to 0.001times as much carbon as silicon, preferably 0.0 to 0.003 times as muchcarbon as silicon. Such a film is sometimes referred to as SiON.Further, a silicon nitride oxide film refers to a film which contains0.1 to 0.3 times as much oxygen as silicon, preferably 0.13 to 0.42times as much oxygen as silicon, and 1 to 2 times as much nitrogen assilicon, preferably 1.1 to 1.6 times as much nitrogen as silicon.Further, the film may contain hydrogen at a proportion of 0.3 to 1.2times as much hydrogen as silicon, preferably 0.51 to 0.91 times as muchhydrogen as silicon. Such a film is sometimes referred to as SiNO. Asthe amorphous semiconductor film 103, silicon, germanium, silicongermanium (Si_(1-x)Ge_(x), where 0<x<0.1), or the like can be used.

For the insulating films 101 and 102 which serve as base protectivefilms and the amorphous semiconductor film 103, a plasma CVD method, asputtering method, an evaporation method, or the like can be used asappropriate. Note that just after the insulating films 101 and 102 whichserve as base protective films and the amorphous semiconductor film 103are formed, that is, before they are heated, their stress may be eithertensile stress or compressive stress.

After being heated, the layer including a semiconductor film which isformed over the substrate has a total stress of −500 N/m to +50 N/m,inclusive, preferably −150 N/m to 0 N/m, inclusive.

Here, as the layer which is formed over the substrate, the insulatingfilms 101 and 102 and the amorphous semiconductor film 103 are formed. Asilicon nitride oxide film with a thickness of zero to 100 nm, a siliconoxynitride film with a thickness of 30 to 120 nm, and an amorphoussemiconductor film with a thickness of 30 to 200 nm are formed as thesefilms.

Further, an insulating film which serves as a base protective film isnot limited to a structure in which two insulating films are stacked. Itmay have a single-layer structure. That is, as the layer including asemiconductor film, a silicon oxynitride film with a thickness of 30 to120 nm can be formed as a base protective film, and an amorphoussemiconductor film with a thickness of 30 to 200 nm can be formed overthe base protective film. Further, instead of the silicon oxynitridefilm, an aluminum nitride film, aluminum oxynitride film, or aluminafilm with a thickness of 30 to 120 nm can be used. In these cases too,the total stress of the insulating film and the amorphous semiconductorfilm after heating is −500 N/m to +50 N/m, inclusive, preferably −150N/m to 0 N/m, inclusive. That is, the product of the film thickness andthe film stress of the insulating film after heating equals the valueobtained when the product of the film thickness of the amorphoussemiconductor film and the film stress of the amorphous semiconductorfilm after heating is subtracted from the total stress after heating.

Further, as the insulating film which serves as a base protective film,three or more layers may be formed. That is, as the layer including asemiconductor film, an aluminum nitride film with a thickness of 30 to120 nm, a silicon nitride oxide film with a thickness of 0 to 100 nm,and a silicon oxynitride film with a thickness of 30 to 120 nm can beformed as base protective films, and an amorphous semiconductor filmwith a thickness of 30 to 200 nm can be formed over the base protectivefilms. Note that concerning the stacking order of the base protectivefilms at this time, a combination in which the aluminum nitride film,the silicon nitride oxide film, and the silicon oxynitride film arestacked over the substrate in that order, a combination in which thesilicon nitride oxide film, the aluminum nitride film, and the siliconoxynitride film are stacked over the substrate in that order, acombination in which the silicon nitride oxide film, the siliconoxynitride film, and the aluminum nitride film are stacked over thesubstrate in that order, or the like can be used as appropriate.Further, in the above three-layer structure, an aluminum oxynitride filmor an alumina film can be used instead of an aluminum nitride film. Inthese cases too, the total stress of the insulating films and theamorphous semiconductor film after heating is −500 N/m to +50 N/m,inclusive, preferably −150 N/m to 0 N/m, inclusive.

Next, as shown in FIG. 1B, the amorphous semiconductor film 103 isirradiated with a laser beam. FIG. 1B is a schematic diagram showingirradiation with a laser beam. The amorphous semiconductor film whichhas been irradiated with a laser beam 104 becomes a crystallinesemiconductor film 105.

When the amorphous semiconductor film 103 is irradiated with the laserbeam, the laser beam is absorbed by the amorphous semiconductor film103, and as the amorphous semiconductor film 103 is heated, the heat isconducted to the substrate 100 and the substrate 100 is also heated. Thetemperature and stress of the substrate surface at this time are shownin FIGS. 2A to 2C. FIG. 2A shows a top view of the substrate 100 in thevicinity of a region which has been irradiated with the laser beam.Here, a mode in which a laser beam is scanned over the substrate in thedirection 110 of the arrow is shown. Further, the crystallinesemiconductor film 105 is a region where the laser beam has already beenscanned and the amorphous semiconductor film has been crystallized. Theamorphous semiconductor film 103 is a region of the amorphoussemiconductor film where the laser beam will be scanned next. Regions111 and 112 are regions which are being irradiated with the laser beam.

When the laser beam is irradiated onto the amorphous semiconductor film,the laser beam that has been irradiated onto the amorphous semiconductorfilm is absorbed by the amorphous semiconductor film. As the amorphoussemiconductor film is heated, the heat is transmitted to the substrate100 and the substrate 100 is also heated. The surface of the substrate100 is locally heated, and part of the surface of the substrate softens.Further, the softened region 111 of the substrate has the heated regions112 of the substrate on either side.

Further, as shown by the temperature trajectory 113 of the substratesurface when the laser beam has been irradiated thereon in FIG. 2B, thetemperature exceeds the softening point in the region 111 where thesubstrate has softened, and in the heated regions 112 of the substrateon either side of the softened region 111, the temperature is higherthan room temperature (RT) and lower than the softening point. Further,the temperature of the crystalline semiconductor film 105 which hasalready been crystallized and of the amorphous semiconductor film 103which has not yet been irradiated with the laser beam is roomtemperature.

Results of a heat conduction simulation which was conducted concerningthe temperature rise of a substrate when the substrate is irradiatedwith a laser beam are shown in FIG. 26. A stacked film including asilicon oxynitride film with a thickness of 100 nm and a silicon nitrideoxide film with a thickness of 50 nm is formed over the substrate. Thetemperature of a surface of the substrate which is maintained at roomtemperature is raised to the melting point of silicon (1685 K)instantaneously at time t=0, and the temperature distribution at asubsequent elapsed time t, where t=t, was calculated by a differencemethod.

In FIG. 26, the horizontal axis shows the depth from a surface of astructure in which a stacked film which includes a 100 nm siliconoxynitride film and a 50 nm silicon nitride oxide film was formed over aglass substrate, and the vertical axis shows the temperature of eachregion, which was calculated by the difference method based on heatconduction equations.

The melt time of an amorphous silicon film when it is irradiated with acontinuous wave laser or a pulsed laser with a repetition rate of 10 MHzor more is approximately 10 μseconds. During the period in which theamorphous silicon film is melting, that region rises to a hightemperature, and the heat is conducted to the substrate as well as tothe stacked film including the 100 nm thick silicon oxynitride film andthe 50 nm thick silicon nitride oxide film. Therefore, the solid lineshows the temperature of each region at an elapsed time t afterirradiation has been conducted with a continuous wave laser or a pulsedlaser with a repetition rate of 10 MHz or more, where t equals 10μseconds. Further, the broken lines show the melting temperature ofsilicon (1685 K) and the melting temperature of glass (1223 K),respectively.

Results in FIG. 26 show that when a time of approximately 10 μsecondshas elapsed after continuous wave laser irradiation or irradiation witha pulsed laser with a repetition rate of 10 MHz or more has beenconducted, the temperature of a region reaching to approximately 1 μmfrom a surface of the glass substrate is greater than or equal to thesoftening point of glass.

That is, it can be seen that when a continuous wave laser or a pulsedlaser beam with a repetition rate of 10 MHz or more is irradiated onto alayer including a semiconductor film, heat is conducted not only to thelayer including a semiconductor film, but also to the glass substratesurface, and the surface of the glass substrate softens.

Further, the stress of the substrate surface at this time is shown bythe stress trajectory 114 in FIG. 2C. In the region 111 where thesubstrate has softened, viscosity is low and stress is not generated, sothe stress is zero. Meanwhile, the heated regions 112 on either side ofthe softened region 111 are in a heated state in which the temperatureis higher than room temperature and lower than the softening point, sotheir volume expands. Therefore, compressive stress is generated in thesubstrate surface. Further, on the periphery of the area of thesubstrate surface where compressive stress has been generated, that is,in the crystalline semiconductor film 105 which has been crystallizedand in the amorphous semiconductor film 103 which has not yet beenirradiated with the laser beam, tensile stress is generated.

When the laser beam is scanned, the irradiation region of the laser beammoves, and in the substrate directly below the irradiation region of thelaser beam, the softened region and the heated regions on either side ofthe softened region start to cool down. FIG. 2D shows a top view of thesubstrate at this time in the vicinity of the region where irradiationhas been conducted with the laser beam. Further, FIGS. 2E and 2F showthe temperature and stress of the substrate surface. The softened regionof the substrate solidifies. In FIG. 2D, the solidified region isindicated by reference numeral 121. Further, heated regions 122 areformed on either side of the solidified region 121. The temperature ofthe substrate surface which has been scanned with the laser beam isshown by the temperature trajectory 123 in FIG. 2E. As shown by thetemperature trajectory 123, the temperature of the substrate surface inthe solidified region 121 and in the heated regions 122 on either sideof the solidified region 121 is higher than room temperature (RT) andlower than the softening point. The stress of the substrate surface atthis time is shown by the stress trajectory 124 in FIG. 2F. The region121, which softened when the temperature of the substrate rose togreater than or equal to the softening point due to the laser beamirradiation, solidifies due to cooling, and contracts. Therefore,tensile stress is generated. Force which acts to prevent the part whichhas started to contract from contracting is applied to the part whichhas started to contract by adjacent parts. Therefore, compressive stressis generated.

The substrate surface falls to room temperature due to further cooling.FIG. 2G shows a top view of the substrate at this time in the vicinityof the region where irradiation has been conducted with the laser beam.Due to cooling, the solidified region and the heated regions cool toroom temperature and become crystalline semiconductor films 131 and 132.The temperature and stress of the substrate surface at this time areshown in FIGS. 2G to 21. As shown by the temperature trajectory 133 ofthe substrate surface where the laser beam has been scanned in FIG. 2H,the temperature of the substrate surface at the solidified crystallinesemiconductor film 131 and the heated regions 132 on either side of thesolidified crystalline semiconductor film 131 is room temperature (RT).The stress of the substrate surface at this time is shown by the stresstrajectory 134 in FIG. 2I. As the temperature of the substrate decreasesto room temperature, the softened region contracts further. However,because it is prevented from contracting by adjacent parts, the tensilestress further increases.

The laser beam irradiation is not conducted over the entire substratesurface simultaneously. Rather, the substrate is irradiated portion byportion when the whole substrate is scanned with the laser beam, andthus the whole substrate is irradiated. Therefore, in the substratesurface, there is a region which is heated by irradiation with the laserbeam and a region which is not heated by irradiation with the laserbeam. Further, when the laser beam moves from the region which has beenirradiated with the laser beam, the region which has been irradiatedwith the laser beam gradually cools to room temperature. Therefore,tensile stress and compressive stress occur sectionally in a part of thesurface of the substrate. This is referred to as a heat distortion. Thelarger the thermal expansion coefficient of the substrate and the lowerthe softening point of the substrate, the larger the heat distortionwhich is generated along with the heating, softening and coolingbecomes, and the more likely it is that a crack will form. Specifically,in the region irradiated by the laser beam, a large amount of tensilestress is generated in a direction which is perpendicular to thescanning direction of the laser beam or the direction of movement of thesubstrate.

If the heat distortion, that is, the tensile stress, in the region ofthe substrate surface which has been irradiated with the laser beambecomes larger than the rupture stress of the substrate, a crack willform in the substrate. Once a crack has formed, stress concentrates inthe crack area, so the crack progresses. The direction in which thecrack progresses is perpendicular to the distribution of tensile stress.That is, it is parallel with the scanning direction of the laser beam.

However, if a layer which has compressive stress after being heated isformed on the surface of the substrate, the tensile stress in thesubstrate surface can be reduced. For this reason, when a layerincluding a semiconductor film is formed over a substrate which has athermal expansion coefficient of greater than 6×10⁻⁷/° C. and less thanor equal to 38×10⁻⁷/° C., preferably greater than 6×10⁻⁷/° C. and lessthan or equal to 31.8×10⁻⁷/° C., and after heating the layer including asemiconductor film, the amorphous semiconductor film is irradiated witha laser beam and thereby a crystalline semiconductor film is formed, thenumber of cracks that form in the substrate and the layer including asemiconductor film can be reduced.

A laser oscillator and an optical system which forms a beam spot, whichare used for crystallization, will be described below. As shown in FIG.3, as laser oscillators 11 a and 11 b, laser oscillators which emit awavelength which is absorbed by the amorphous semiconductor film 103 ata rate of several tens of percent or more are used. Representatively,from a fundamental wave to a fourth harmonic can be used. Here, acontinuous wave laser (YVO₄, a second harmonic (a wavelength of 532 nm))with LD excitation (laser diode excitation) which has a maximum totaloutput of 20 W is prepared. It is not particularly necessary to limitthe wavelength of the laser to a second harmonic. However, a secondharmonic is superior to a further higher order harmonic in terms ofenergy efficiency.

When the amorphous semiconductor film 103 is irradiated with thecontinuous wave laser, energy is continuously provided to the amorphoussemiconductor film 103. Therefore, once the semiconductor film has beenbrought to a molten state, the molten state can be maintained. Further,a solid-liquid interface of the semiconductor film can be moved byscanning the continuous wave laser, so crystal grains which are long inone direction, which is the direction in which the laser moves, can beformed. A solid-state laser is used because compared with a gas laser orthe like, the output of a solid-state laser is highly stable, so stableprocessing can be expected. Note that the laser is not limited to acontinuous wave laser. A pulsed laser with a repetition rate of greaterthan or equal to 10 MHz can also be used. When a pulsed laser with ahigh repetition rate is used, as long as a pulse interval of the laseris shorter than the period of time it takes for the semiconductor filmto solidify after being melted, the semiconductor film can be kept in amolten state. Thus, a semiconductor film composed of crystal grainswhich are long in one direction can be formed by the movement of thesolid-liquid interface. Note that FIG. 3 shows a case where two laseroscillators are prepared; however, one laser oscillator may be preparedas long as output is sufficient.

For example, as a gas laser, an Ar laser, a Kr laser, a CO₂ laser, orthe like may be used. As a solid-state laser, a YAG laser, a YLF laser,a YAlO₃ laser, a GdVO₄ laser, a KGW laser, a KYW laser, an alexandritelaser, a Ti:sapphire laser, a Y₂O₃ laser, a YVO₄ laser, or the like maybe used. Further, a ceramic laser such as a YAG laser, a Y₂O₃ laser, aGdVO₄ laser, or a YVO₄ laser may be used. As a metal vapor laser, ahelium cadmium laser or the like may be used.

Further, concerning the laser oscillators 11 a and 11 b, it ispreferable to emit a laser beam with oscillation of TEM₀₀ (a singletransverse mode), because by doing so, a light-concentrating property ofa linear beam spot that is obtained on the surface to be irradiated 18can be improved, and energy density of the linear beam spot that isobtained on the surface to be irradiated 18 can be increased.

A brief description of the laser irradiation follows. Laser beams 12 aand 12 b are each emitted with the same energy from the laseroscillators 11 a and 11 b. A polarization direction of the laser beam 12b emitted from the laser oscillator 11 b is changed through a wavelengthplate 13. The polarization direction of the laser beam 12 b is changedbecause the two laser beams which have different polarization directionsto one another are synthesized by a polarizer 14. After the laser beam12 b is passed through the wavelength plate 13, the laser beam 12 b isreflected by a mirror 22 and made to enter the polarizer 14. Then, thelaser beam 12 a and the laser beam 12 b are synthesized into a laserbeam 12 by the polarizer 14. The wavelength plate 13 and the polarizer14 are adjusted so that light that has transmitted through thewavelength plate 13 and the polarizer 14 has an appropriate energy. Notethat in this embodiment mode, the polarizer 14 is used for synthesizingthe laser beams; however, other optical elements such as a polarizationbeam splitter may also be used.

The laser beam 12 that has been synthesized by the polarizer 14 isreflected by a mirror 15, and a cross section of the laser beam isformed into a linear shape on the surface to be irradiated 18 by acylindrical lens 16 with a focal length of, for example, 150 mm, and acylindrical lens 17 with a focal length of, for example, 20 mm. Themirror 15 may be provided depending on setup conditions of an opticalsystem of a laser irradiation apparatus. The cylindrical lens 16operates in the lengthwise direction of the beam spot that is formed onthe surface to be irradiated 18, while the cylindrical lens 17 operatesin the crosswise direction of the beam spot that is formed on thesurface to be irradiated 18. Accordingly, in the surface to beirradiated 18, a linear beam spot having a length of approximately 500μm and a width of approximately 20 μm, for example, is formed. Note thatin this embodiment mode, the cylindrical lenses are used to form thelinear beam spot into a linear shape. However, the invention is notlimited to this, and other optical elements such as spherical lenses mayalso be used. Further, the focal lengths of the cylindrical lenses arenot limited to the above values, and can be set freely.

Further, in this embodiment mode, the laser beam is formed using thecylindrical lenses 16 and 17; however, an optical system for extendingthe laser beam into a linear shape and an optical system forconcentrating the light narrowly on the surface to be irradiated may beadditionally provided. For example, in order to make the cross sectionof the laser beam linear, a cylindrical lens array, a diffractiveoptical element, an optical waveguide, or the like can be used. Further,if a medium of the laser which has a rectangular shape is used, thecross section of the laser beam can be made linear at emission stage. Aceramic laser can form a shape of a medium of a laser relatively freely,so a ceramic laser is suitable for manufacturing such a laser. Note thatthe cross-section of the laser beam which is made into a linear shape ispreferably as narrow as possible. This increases energy density of thelaser beam in the semiconductor film, and therefore, processing time canbe reduced.

Next, an irradiation method of the laser beam will be described. Inorder to move the surface to be irradiated 18 over which the amorphoussemiconductor film 103 is formed at a relatively high speed, the surfaceto be irradiated 18 is fixed to a wafer stage 19. The wafer stage 19 canbe moved in X and Y directions on a plane parallel to the surface to beirradiated 18 by an x-axis one-axis robot 20 and a y-axis one-axis robot21. The one-axis robots 20 and 21 are disposed such that the lengthwisedirection of the linear beam spot corresponds to the y-axis. Next, thesurface to be irradiated 18 is moved in line with the crosswisedirection of the beam spot, that is, in line with the x-axis, and thesurface to be irradiated 18 is irradiated with the laser beam. Here, ascanning speed of the x-axis one-axis robot 20 is 35 cm/sec, and each ofthe two laser oscillators emits a laser beam whose energy is 7.0 W. Thelaser output after the laser beams have been synthesized is 14 W.

When the semiconductor film is irradiated with the laser beam, a regionwhich is completely melted is formed in the semiconductor film. Crystalsgrow during a solidifying process, so a crystalline semiconductor filmcan be formed. Note that energy distribution of the laser beams emittedfrom the laser oscillators in a TEM₀₀ mode generally corresponds to aGaussian distribution. Note also that the intensity of the laser beamscan be made uniform by the optical system used for the laser beamirradiation. For example, intensity of the laser beam can be madeuniform by using a lens array such as a cylindrical lens array or a flyeye lens; a diffractive optical element; an optical waveguide; or thelike. An appropriate scanning speed for the x-axis one-axis robot 20 isapproximately several tens to several hundreds of cm/sec. The speed maybe decided as appropriate by a worker in accordance with the output ofthe laser oscillators.

Note that in this embodiment mode, a mode is used in which the amorphoussemiconductor film 103, which is the surface to be irradiated 18, ismoved using the x-axis one-axis robot 20 and the y-axis one-axis robot21. The invention is not limited to this, and the laser beam can bescanned using a method for moving an irradiation system in which thesurface to be irradiated 18 is fixed while an irradiation position ofthe laser beam is moved; a method for moving a surface to be irradiatedin which the irradiation position of the laser beam is fixed while thesurface to be irradiated 18 is moved; or a method in which these twomethods are combined.

Note that as described above, the energy distribution of the beam spot,which is formed by the above-described optical system, is in a Gaussiandistribution in the major axis direction. Therefore, a small graincrystal is formed at places where the energy density is low, at bothmajor axis ends of the beam. Thus, part of the laser beam may be cut byproviding a slit or the like in front of the surface to be irradiated18, so that the surface to be irradiated 18 is irradiated only withsufficient energy to form a large grain crystal. Further, in order toutilize the laser beam emitted from the laser oscillators 11 a and 11 bmore efficiently, the energy of the beam spot may be uniformlydistributed in the lengthwise direction by using a beam homogenizer suchas a lens array or a diffractive optical element.

Further, the y-axis one-axis robot 21 is moved by a distance equal tothe width of the crystalline semiconductor film that is formed, and thex-axis one-axis robot 20 is rescanned at a predetermined speed, which is35 cm/sec here. By repeating a series of such operations, an entiresurface of the semiconductor film can be efficiently crystallized.

By the above-described process, the whole amorphous semiconductor filmis irradiated with the laser beam, thereby forming the crystallinesemiconductor film 105, as shown in FIG. 1C.

Subsequently, the crystalline semiconductor film is selectively etchedto form a semiconductor film, and the semiconductor film is used to forma semiconductor element. As the semiconductor element, a thin filmtransistor, a nonvolatile memory element having a floating gate or acharge storage layer, a diode, a capacitor, a resistor, or the like canbe formed. Here, a thin film transistor 150 is formed, as shown in FIG.1D.

Further, the semiconductor element can be used to manufacture asemiconductor device.

Note that in this embodiment mode, a separation film may be providedbetween the insulating film 101 and the substrate 100, and afterprocessing, the semiconductor element formed over the insulating film101 may be separated from the substrate 100. Then, by attaching thesemiconductor element to a substrate having flexibility, a thin andlightweight semiconductor device can be manufactured.

Below, a method for measuring stress which is used in this specificationwill be described. The stress referred to in this specification ismeasured using a Tencor FLX-2320 (manufactured by KLA TencorCorporation). The Tencor FLX-2320 measures the change in the curvatureradius of a substrate having a thin film which is under stress. Stressof the thin film is found using Mathematical Formula 2.

$\begin{matrix}{\sigma = \frac{{Eh}^{2}}{\left( {1 - v} \right)\; 6R\; t}} & \left\lbrack {{Mathematical}\mspace{14mu} {Formula}\mspace{20mu} 2} \right\rbrack\end{matrix}$

In Mathematical Formula 2, E/(1−v) represents a biaxial elasticitycoefficient of the substrate, E represents a Young's modulus of thesubstrate, and v represents a Poisson's ratio of the substrate. Further,as shown in FIGS. 25A to 25C, h represents the thickness (m) of asubstrate 600, t represents the thickness (m) of a thin film 601, Rrepresents the curvature radius (m) of the substrate 600, and σrepresents a stress (Pa) of the thin film 601 which is formed over thesubstrate 600.

Note that in this specification, for the AN100 substrate which is usedas a substrate, the Poisson's ratio is 0.22 and the Young's modulus is77 GPa. Therefore, its biaxial elasticity coefficient is 98.7 GPa. Forthe EAGLE2000 substrate which is used as a substrate, the Poisson'sratio is 0.23 and the Young's modulus is 70.9 GPa. Therefore, itsbiaxial elasticity coefficient is 92.07 GPa.

Further, generally, types of stress include tensile stress andcompressive stress. As shown in FIG. 25B, when the thin film 601contracts with respect to the substrate 600, the substrate 600 stretchesin a direction which prevents the contraction. Therefore, the substrate600 changes to a shape which has the thin film 601 on its inner side.Stress generated when the thin film 601 contracts in this manner isreferred to as tensile stress. Meanwhile, as shown in FIG. 25C, when thethin film 601 expands, the substrate 600 contracts and pushes againstthe inner side of the thin film 601. Stress generated when the thin film601 expands in this manner is referred to as compressive stress.Generally, it is often the case that tensile stress is indicated witha + (plus) sign and compressive stress is indicated with a − (minus)sign.

Embodiment Mode 2

In this embodiment mode, a liquid crystal display device which is anexample of a semiconductor device will be described with reference toFIGS. 4A to 4D and FIGS. 5A to 5C.

As in Embodiment Mode 1, the insulating film 101 is formed over thesubstrate 100 which has a thermal expansion coefficient of greater than6×10⁻⁷/° C. and less than or equal to 38×10⁻⁷/° C., preferably greaterthan 6×10⁻⁷/° C. and less than or equal to 31.8×10⁻⁷/° C., and theamorphous semiconductor film 103 is formed over the insulating film 101,as shown in FIG. 4A. Here, an AN100 substrate with a thermal expansioncoefficient of 38×10⁻⁷/° C. and a thickness of 0.7 cm is used as thesubstrate 100. Further, as the insulating film 101, a silicon nitridefilm containing oxygen with a thickness of 40 to 60 nm and a siliconoxide film containing nitrogen with a thickness of 80 to 120 nm are eachformed by a plasma CVD method. Further, as the amorphous semiconductorfilm 103, an amorphous semiconductor film with a thickness of 20 to 80nm is formed by a plasma CVD method.

Next, the substrate 100 is heated. Here, heating for removing hydrogenwhich is in the amorphous semiconductor film formed over the substrate100 is performed. Alternatively, heating for crystallizing the amorphoussemiconductor film may be performed. When the substrate 100 is heated,the total stress of the layer over the substrate becomes −500 N/m to +50N/m, inclusive, preferably −150 N/m to 0 N/m, inclusive. Even when alayer such as this is subsequently irradiated with the laser beam 104,the number of cracks that form in the substrate and the layer over thesubstrate can be reduced. Here, the substrate 100 is heated for one hourat 500° C., then heated for four hours at 550° C.

Next, as shown in FIG. 4B, the amorphous semiconductor film 103 isirradiated with the laser beam 104. An energy level selected for thelaser beam 104 is an energy level at which the laser beam 104 can meltthe amorphous semiconductor film 103. Further, a wavelength selected forthe laser beam 104 is a wavelength which can be absorbed by theamorphous semiconductor film 103. As a result, the crystallinesemiconductor film 105 can be formed over the insulating film 101. Here,a second harmonic of a YVO₄ laser (wavelength 532 nm) is used as thelaser beam 104.

Next, as shown in FIG. 4C, the crystalline semiconductor film 105 isselectively etched to form semiconductor films 201, 202, and 203. Here,as a method for etching the crystalline semiconductor film 105, dryetching, wet etching, or the like can be used. Here, after a resist isapplied over the crystalline semiconductor film 105, exposure anddevelopment are conducted to form a resist mask. Next, using the resistmask, the crystalline semiconductor film 105 is selectively etched by adry etching method in which the flow ratio of SF₆:O₂ is 4:15.Subsequently, the resist mask is removed.

Then, as shown in FIG. 4D, a gate insulating film 204 is formed over thesemiconductor films 201 to 203. The gate insulating film is formed ofsilicon nitride, silicon nitride containing oxygen, silicon oxide,silicon oxide containing nitrogen, or the like, as a single layer or astacked layer structure. Here, silicon oxide containing nitrogen whichis formed by a plasma CVD method to a thickness of 115 nm is used as thegate insulating film.

Next, gate electrodes 205, 206, 207, and 208 are formed. The gateelectrodes 205 to 208 can be formed of a metal or of a polycrystallinesemiconductor doped with an impurity which has one conductivity type. Inthe case of using a metal, tungsten (W), molybdenum (Mo), titanium (Ti),tantalum (Ta), aluminum (Al), or the like can be used. Further, a metalnitride obtained by nitriding the metal can be used. Alternatively, astructure in which a first layer including the metal nitride and asecond layer including the metal are stacked may be used. Further, adroplet discharge method can be used to discharge a paste containingminute particles over the gate insulating film, and the paste can bedried or baked to form the gate electrode. Further, a paste containingminute particles can be printed over the gate insulating film by aprinting method, and dried or baked to form the gate electrode. Asrepresentative examples of the minute particles, minute particlescontaining gold, copper, an alloy of gold and silver, an alloy of goldand copper, an alloy of silver and copper, or an alloy of gold, silverand copper as a main component may be used. Here, a tantalum nitridefilm with a thickness of 30 nm and a tungsten film with a thickness of370 nm are formed over the gate insulating film 204 by a sputteringmethod. Then, a resist mask formed by a photolithography process is usedin selectively etching the tantalum nitride film and the tungsten filmto form gate electrodes 205 to 208 in which an end portion of thetantalum nitride film protrudes out more than an end portion of thetungsten film.

Next, using the gate electrodes 205 to 208 as masks, the semiconductorfilms 201 to 203 are each doped with an impurity element which impartsan n-type conductivity and an impurity element which imparts a p-typeconductivity to form source regions and drain regions 209, 210, 211,212, 213, and 214, and a high concentration impurity region 215.Further, low concentration impurity regions 216, 217, 218, 219, 220,221, 222, and 223, which overlap with a part of the gate electrodes 205to 208, are formed. Here, the source regions and drain regions 209, 210,and 213 to 215, and the low concentration impurity regions 216, 217, and220 to 223 are doped with boron, which is an impurity element thatimparts a p-type conductivity. Further, the source regions and drainregions 211 and 212 and the low concentration impurity regions 218 and219 are doped with phosphorus, which is an impurity element that impartsan n-type conductivity.

Subsequently, heat treatment is performed to activate the impurityelements with which the semiconductor film has been doped. Here, heatingis performed for four hours at 550° C. under a nitrogen atmosphere.Through the above process steps, thin film transistors 225, 226, and 227are formed. Note that as the thin film transistors 225 and 227,p-channel thin film transistors are formed, while as the thin filmtransistor 226, an n-channel thin film transistor is formed. Further, adriver circuit is formed by the p-channel thin film transistor 225 andthe n-channel thin film transistor 226. Further, the p-channel thin filmtransistor 227 serves as an element which applies a voltage to a pixelelectrode.

Next, as shown in FIG. 5A, a first interlayer insulating film whichinsulates the gate electrodes and wirings of the thin film transistors225 to 227 is formed. Here, a silicon oxide film 231, a silicon nitridefilm 232, and a silicon oxide film 233 are stacked to form the firstinterlayer insulating film. Further, wirings 234, 235, 236, 237, 238,and 239, which are connected to the source regions and drain regions ofthe thin film transistors 225 to 227, and a connecting terminal 240 areformed over the silicon oxide film 233, which is a part of the firstinterlayer insulating film. Here, after a 100 nm Ti film, a 333 nm Alfilm, and a 100 nm Ti film are formed in sequence by a sputteringmethod. Then, the films are selectively etched, using a resist maskformed by a photolithography process as a resist mask, to form thewirings 234 to 239 and the connection terminal 240. After that, theresist mask is removed.

Next, a second interlayer insulating film 241 is formed over the firstinterlayer insulating film, the wirings 234 to 239, and the connectingterminal 240. As the second interlayer insulating film 241, an inorganicinsulating film such as a silicon oxide film, a silicon nitride film, ora silicon oxynitride film can be used. The second interlayer insulatingfilm 241 may be a single layer or a plurality of layers including two ormore layers of these insulating films. Further, as a method of formingthe inorganic insulating film, a sputtering method, an LPCVD method, aplasma CVD method, or the like may be used. Here, a plasma CVD method isused to form a silicon nitride film containing oxygen with a thicknessof 100 nm to 150 nm. Then, using a resist mask formed by aphotolithography process as a resist mask, the silicon nitride filmcontaining oxygen is selectively etched to form the second interlayerinsulating film 241, as well as the wiring 239 of the thin filmtransistor 227 and a contact hole which reaches the connecting terminal240. Subsequently, the resist mask is removed.

By forming the second interlayer insulating film 241, as in thisembodiment mode, exposure of TFTs of a driver circuit portion, wirings,and the like can be prevented, and the TFTs can be protected fromcontaminants.

Next, a first pixel electrode 242, which connects to the wiring 239 ofthe thin film transistor 227, and a conductive film 244 which connectsto the connection terminal 240 are formed. In a case where the liquidcrystal display device is a light-transmitting liquid crystal displaydevice, the first pixel electrode 242 is formed with a conductive filmhaving a light-transmitting property. Further, in a case where theliquid crystal display device is a reflective liquid crystal displaydevice, the first pixel electrode 242 is formed with a conductive filmhaving a reflective property. Here, a sputtering method is used to formITO containing silicon oxide to a thickness of 125 nm. Then, the ITOcontaining silicon oxide is selectively etched, using a resist maskformed by a photolithography process as a resist mask, to form the firstpixel electrode 242 and the conductive film 244.

Next, an insulating film 243 which serves as an orientation film isformed. The insulating film 243 can be formed by forming amacromolecular compound film such as a polyimide film or a polyvinylalcohol film by a printing method, a roll coating method, or the like,then performing rubbing. Further, the insulating film 243 can be formedby depositing SiO obliquely with respect to the substrate. Furthermore,the insulating film 243 can be formed by irradiating a photoreactivemacromolecular compound with polarized UV light to polymerize thephotoreactive macromolecular compound. Here, the insulating film 243 isformed by printing a macromolecular compound film such as a polyimidefilm or a polyvinyl alcohol film using a printing method, baking themacromolecular compound film, then rubbing the macromolecular compoundfilm.

Next, as shown in FIG. 5B, a second pixel electrode 253 is formed over acounter substrate 251, and an insulating film 254 which serves as anorientation film is formed over the second pixel electrode 253. Notethat a coloring film 252 may be provided between the counter substrate251 and the second pixel electrode 253.

As the counter substrate 251, similar materials as for the substrate 100can be selected as appropriate. Further, the second pixel electrode 253can be formed using similar methods as for the first pixel electrode242. Furthermore, the insulating film 254 which serves as an orientationfilm can be formed similarly to the insulating film 243. Concerning thecoloring film 252, which is a film that is necessary when color displayis conducted, in the case of a RGB method, coloring films, in which dyesor pigments which correspond to each color, red, green, and blue, aredispersed, are formed corresponding to each pixel.

Next, the substrate 100 and the counter substrate 251 are bondedtogether using a sealant 257. Further, a liquid crystal layer 255 isformed between the substrate 100 and the counter substrate 251.Furthermore, the liquid crystal layer 255 can be formed by using avacuum injection method which utilizes capillarity to inject a liquidcrystal material into a region which is enclosed by the insulating films243 and 254 which serve as orientation films and the sealant 257.Alternatively, the liquid crystal layer 255 can be formed by forming asealant 257 over one surface of the counter substrate 251, then adding aliquid crystal material dropwise to a region enclosed by the sealant,and then attaching the counter substrate 251 and the substrate 100together by pressure using the sealant, under reduced pressure.

As the sealant 257, a thermosetting epoxy resin, a UV-curable acrylicresin, a thermoplastic nylon, a polyester, or the like can be formedusing a dispensing method, a printing method, a thermocompressionmethod, or the like. Note that by dispersing a filler in the sealant257, the distance between the substrate 100 and the counter substrate251 can be maintained. Here, a thermosetting epoxy resin is used to formthe sealant 257.

Further, in order to maintain the space between the substrate 100 andthe counter substrate 251, spacers 256 may be provided the insulatingfilms 243 and 254 which serve as orientation films. A spacer can beformed by applying an organic resin and etching the organic resin into adesired shape; representatively, a columnar shape or a cylindricalshape. Further, spacer beads may be used as the spacers. Here, spacerbeads are used as the spacers 256.

Further, one or both of the substrate 100 and the counter substrate 251are provided with a polarizing plate, although this is not shown in thedrawings.

Next, as shown in FIG. 5C, in a terminal portion 263, a connectionterminal which is connected to a gate wiring or a source wiring of athin film transistor (in FIG. 5C, the connection terminal 240 which isconnected to a source wiring or a drain wiring is shown) is formed. AnFPC (flexible printed circuit) 262 which serves as an external inputterminal is connected to the connection terminal 240 through theconductive film 244 and an anisotropic conductive film 261. Theconnection terminal 240 receives video signals and clock signals throughthe conductive film 244 and the anisotropic conductive film 261.

A circuit which drives a pixel, such as a source driver or a gatedriver, is formed in a driver circuit portion 264. Here, an n-channelthin film transistor 226 and a p-channel thin film transistor 225 aredisposed. Note that the n-channel thin film transistor 226 and thep-channel thin film transistor 225 form a CMOS circuit.

A plurality of pixels is formed in a pixel portion 265, and a liquidcrystal element 258 is formed in each pixel. The liquid crystal element258 is a portion in which the first pixel electrode 242, the secondpixel electrode 253, and the liquid crystal layer 255, which fills thegap between the first pixel electrode 242 and the second pixel electrode253, overlap with each other. The first pixel electrode 242 included inthe liquid crystal element 258 is electrically connected to the thinfilm transistor 227.

The liquid crystal display device can be manufactured by theabove-described process. In the liquid crystal display device describedin this embodiment mode, the number of cracks that form in the substrateand the layer over the substrate during the manufacturing process can bereduced. Therefore, liquid crystal display devices can be manufacturedwith a high yield rate.

Embodiment Mode 3

In this embodiment mode, a manufacturing process of a light emittingdevice having a light emitting element which is an example of asemiconductor device will be described.

As shown in FIG. 6A, the thin film transistors 225 to 227 are formedover the substrate 100 with the insulating film 101 therebetween usingsimilar processing steps to those in Embodiment Mode 2. Further, thesilicon oxide film 231, the silicon nitride film 232, and a siliconoxide film 233 are stacked as a first interlayer insulating film whichinsulates the gate electrodes and wirings of the thin film transistors225 to 227. Further, wirings 308, 309, 310, 311, 312, and 313 which areconnected to a semiconductor film of the thin film transistors 225 to227, and a connecting terminal 314 are formed over the silicon oxidefilm 233, which is a part of the first interlayer insulating film.

Next, a second interlayer insulating film 315 is formed over the firstinterlayer insulating film, the wirings 308 to 313, and the connectingterminal 314. Next, a first electrode 316 which is connected to thewiring 313 of the thin film transistor 227 and a conductive film 320which connects to the connecting terminal 314 are formed. To form thefirst electrode 316 and the conductive film 320, a sputtering method isused to form ITO containing silicon oxide to a thickness of 125 nm, andthen the ITO containing silicon oxide is selectively etched, using aresist mask formed by a photolithography process as a resist mask.

By forming the second interlayer insulating film 315, as in thisembodiment mode, exposure of TFTs of a driver circuit portion, wirings,and the like can be prevented, and the TFTs can be protected fromcontaminants.

Next, an organic insulating film 317 which covers an end portion of thefirst electrode 316 is formed. Here, a photosensitive polyimide isapplied and baked. Then, exposure and development is conducted to formthe organic insulating film 317 such that a driver circuit, the firstelectrode 316 in a pixel region, and the second interlayer insulatingfilm 315 on the periphery of the pixel region are exposed.

Next, a layer 318 containing a light-emitting substance is formed by anevaporation method over a part of the first electrode 316 and theorganic insulating film 317. The layer 318 containing a light-emittingsubstance is formed of an organic or inorganic compound having alight-emitting property. Further, the layer 318 containing alight-emitting substance may be formed of an organic compound having alight-emitting property and an inorganic compound having alight-emitting property. Moreover, a red-light-emitting pixel, ablue-light-emitting pixel, and a green-light-emitting pixel can beformed by using a red-light-emitting substance, a blue-light-emittingsubstance, and a green-light-emitting substance, respectively, for thelayer 318 containing a light-emitting substance.

Here, the layer containing a red-light-emitting substance is formed bystacking DNTPD which is 50 nm thick, NPB which is 10 nm thick, NPB whichis 30 nm thick to whichbis[2,3-bis(4-fluorophenyl)quinoxalinato]iridium(acetylacetonate)(abbr.: Ir(Fdpq)₂(acac)) is added, Alq₃ which is 60 nm thick, and LiFwhich is 1 nm thick.

Further, the layer containing a green-light-emitting substance is formedby stacking DNTPD which is 50 nm thick, NPB which is 10 nm thick, Alq₃which is 40 nm thick to which coumarin 545T (C545T) is added, Alq₃ whichis 60 nm thick, and LiF which is 1 nm thick.

The layer containing a blue-light-emitting substance is formed bystacking DNTPD which is 50 nm thick, NPB which is 10 nm thick,9-[4-(N-carbazolyl)]phenyl-10-phenylanthracene (abbr.: CzPA) which is 30nm thick to which 2,5,8,11-tetra(tert-butyl)perylene (abbr.: TBP) isadded, Alq₃ which is 60 nm thick, and LiF which is 1 nm thick.

Moreover, in addition to the red-light-emitting pixel, theblue-light-emitting pixel, and the green-light-emitting pixel, awhite-light-emitting pixel may be formed, by forming the layercontaining a light-emitting substance using a white light-emittingsubstance. By providing a white-light-emitting pixel, power consumptioncan be reduced.

Next, a second electrode 319 is formed over the layer 318 containing alight-emitting substance and the organic insulating film 317. Here, anAl film is formed to a thickness of 200 nm by an evaporation method.Accordingly, a light-emitting element 321 is formed by the firstelectrode 316, the layer 318 containing a light-emitting substance, andthe second electrode 319.

A structure of the light-emitting element 321 will be described below.

When the layer 318 containing a light-emitting substance is formed by alayer which uses an organic compound and which has a light-emittingfunction (hereinafter, this layer will be referred to as alight-emitting layer 343), the light-emitting element 321 functions asan organic EL element.

As an organic compound with a light-emitting property, for example,9,10-di(2-naphthyl)anthracene (abbr.: DNA);2-tert-butyl-9,10-di(2-naphthyl)anthracene (abbr.: t-BuDNA);4,4′-bis(2,2-diphenylvinyl)biphenyl (abbr.: DPVBi); coumarin 30;coumarin 6; coumarin 545; coumarin 545T; perylene; rubrene;periflanthene; 2,5,8,11-tetra(tert-butyl)perylene (abbr.: TBP);9,10-diphenylanthracene (abbr.: DPA); 5,12-diphenyltetracene;4-(dicyanomethylene)-2-methyl-6-[p-(dimethylamino)styryl]-4H-pyran(abbr.: DCM1);4-(dicyanomethylene)-2-methyl-6-[2-(joulolidine-9-yl)ethenyl]-4H-pyran(abbr.: DCM2);4-(dicyanomethylene)-2,6-bis[p-(dimethylamino)styryl]-4H-pyran (abbr.:BisDCM); or the like may be used. Further, the following compoundscapable of emitting phosphorescent light can also be used:bis[2-(4′,6′-difluorophenyl)pyridinato-N,C²′](picolinato)iridium (abbr.:FIrpic);bis{2-[3′,5′-bis(trifluoromethyl)phenyl]pyridinato-N,C²′}(picolinato)iridium(abbr.: Ir(CF₃ppy)₂(pic)); tris(2-phenylpyridinato-N,C²′)iridium (abbr.:Ir(ppy)₃); (acetylacetonato)bis(2-phenylpyridinato-N,C²′)iridium (abbr.:Ir(ppy)₂(acac));(acetylacetonato)bis[2-(2′-thienyl)pyridinato-N,C³′]iridium (abbr.:Ir(thp)₂(acac)); (acetylacetonato)bis(2-phenylquinolinato-N,C²′)iridium(abbr.: Ir(pq)₂(acac));(acetylacetonato)bis[2-(2′-benzothienyl)pyridinato-N,C³′]iridium (abbr.:Ir(btp)₂(acac)); and the like.

Further, as shown in FIG. 7A, the light-emitting element 321 may includethe first electrode 316 and also the layer 318 containing alight-emitting substance and the second electrode 319, which are formedover the first electrode 316. The layer 318 containing a light-emittingsubstance includes a hole-injecting layer 341 formed of a material witha hole-injecting property, a hole-transporting layer 342 formed of amaterial with a hole-transporting property, the light-emitting layer 343formed of an organic compound with a light-emitting property, anelectron-transporting layer 344 formed of a material with anelectron-transporting property, and an electron-injecting layer 345formed of a material with an electron-injecting property.

As the material with a hole-transporting property, phthalocyanine(abbr.: H₂Pc); copper phthalocyanine (abbr.: CuPc); vanadylphthalocyanine (abbr.: VOPc);4,4′,4″-tris(N,N-diphenylamino)triphenylamine (abbr.: TDATA);4,4′,4″-tris[N-(3-methylphenyl)-N-phenylamino]triphenylamine (abbr.:MTDATA); 1,3,5-tris[N,N-di(m-tolyl)amino]benzene (abbr.: m-MTDAB);N,N′-diphenyl-N,N′-bis (3-methylphenyl)-1,1′-biphenyl-4,4′-diamine(abbr.: TPD); 4,4′-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (abbr.:NPB); 4,4′-bis{N-[4-di(m-tolyl)amino]phenyl-N-phenylamino}biphenyl(abbr.: DNTPD); 4,4′-bis[N-(4-biphenylyl)-N-phenylamino]biphenyl (abbr.:BBPB); 4,4′,4″-tri(N-carbazolyl)triphenylamine (abbr.: TCTA); and thelike may be used. Note that the invention is not limited to these. Amongthe above compounds, an aromatic amine compound typified by TDATA,MTDATA, m-MTDAB, TPD, NPB, DNTPD, BBPB, TCTA, or the like is preferableas the organic compound because it easily generates holes. Thesubstances mentioned here generally have a hole mobility of 10⁻⁶ cm²/Vsor more.

As a material with a hole-injecting property, the aforementionedmaterials with a hole-transporting property can be used. Further, achemically-doped conductive macromolecular compound can also be used.For example, polyethylene dioxythiophene (abbr.: PEDOT) doped withpolystyrene sulfonate (abbr.: PSS); polyaniline (abbr.: PAni); or thelike can also be used. Further, a thin film of an inorganicsemiconductor such as molybdenum oxide, vanadium oxide, or nickel oxide,or an ultrathin film of an inorganic insulator such as aluminum oxide isalso effective.

Here, a material with an electron-transporting property may be amaterial including a metal complex with a quinoline skeleton or abenzoquinoline skeleton, or the like such as the following:tris(8-quinolinolato)aluminum (abbr.: Alq₃),tris(4-methyl-8-quinolinolato)aluminum (abbr.: Almq₃),bis(10-hydroxybenzo[h]-quinolinato)beryllium (abbr.: BeBq₂),bis(2-methyl-8-quinolinolato)-4-phenylphenolato-aluminum (abbr.: BAlq),or the like. Further, a metal complex having an oxazole ligand or athiazole ligand, or the like can also be used, such asbis[2-(2-hydroxyphenyl)benzoxazolato]zinc (abbr.: Zn(BOX)₂), orbis[2-(2-hydroxyphenyl)benzothiazolato]zinc (abbr.: Zn(BTZ)₂). As analternative to a metal complex,2-(4-biphenylyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole (abbr.: PBD),1,3-bis[5-(p-tert-butylphenyl)-1,3,4-oxadiazole-2-yl]benzene (abbr.:OXD-7), 3-(4-tert-butylphenyl)-4-phenyl-5-(4-biphenylyl)-1,2,4-triazole(abbr.: TAZ),3-(4-tert-butylphenyl)-4-(4-ethylphenyl)-5-(4-biphenylyl)-1,2,4-triazole(abbr.: p-EtTAZ), bathophenanthroline (abbr.: BPhen), bathocuproin(abbr.: BCP), or the like can be used. The substances mentioned heregenerally have an electron mobility of 10⁻⁶ cm²/Vs or more.

As a material with an electron-injecting property, the aforementionedmaterials with an electron-transporting property may be used. Further,an ultrathin film of an insulator such as the following is often used: ahalide of an alkali metal, such as lithium fluoride or cesium fluoride;a halide of an alkaline-earth metal, such as calcium fluoride; or anoxide of an alkali metal, such as lithium oxide. Further, an alkalimetal complex such as lithium acetyl acetonate (abbr.: Li(acac)) or8-quinolinolato-lithium (abbr.: Liq) is also effective. Furthermore, amaterial mixed by, for example, co-evaporating an aforementionedmaterial with an electron-transporting property and a metal with a lowwork function such as Mg, Li, or Cs can also be used.

As shown in FIG. 7B, the light-emitting element 321 may be formed by thefirst electrode 316, the layer 318 containing a light-emittingsubstance, and the second electrode 319. The layer 318 containing alight-emitting substance includes a hole-transporting layer 346 formedof an organic compound with a light emitting property and an inorganiccompound having an electron-accepting property with respect to theorganic compound with a light emitting property, the light-emittinglayer 343 formed of an organic compound with a light-emitting property,and an electron-transporting layer 347 formed of an organic compoundwith a light emitting property and an inorganic compound having anelectron-donating property with respect to the organic compound with alight-emitting property.

As the organic compound for the hole-transporting layer 346 formed ofthe organic compound with a light-emitting property and the inorganiccompound having an electron-accepting property with respect to theorganic compound with a light-emitting property, an aforementionedorganic compound with a hole-transporting property may be used asappropriate. Further, the inorganic compound may be any kind ofinorganic compound as long as it can easily accept electrons from theorganic compound. As the inorganic compound, various metal oxides ormetal nitrides can be used. In particular, an oxide of a transitionmetal belonging to any of Group 4 to Group 12 in the periodic table ispreferable because it is likely to exhibit electron-acceptingproperties. Specifically, titanium oxide, zirconium oxide, vanadiumoxide, molybdenum oxide, tungsten oxide, rhenium oxide, ruthenium oxide,zinc oxide, or the like can be used. Among these metal oxides, oxides oftransition metals belonging to any of Group 4 to Group 8 in the periodictable are preferable because many of them easily accept electrons. Inparticular, vanadium oxide, molybdenum oxide, tungsten oxide, andrhenium oxide are preferable because they can be formed by vacuumevaporation and are easy to handle.

As the organic compound for the electron-transporting layer 347 formedof the organic compound with a light-emitting property and the inorganiccompound having an electron-donating property with respect to theorganic compound with a light-emitting property, an aforementionedorganic compound with an electron-transporting property may be used asappropriate. Further, the inorganic compound may be any kind ofinorganic compound as long as it can easily donate electrons to theorganic compound. As the inorganic compound, various metal oxides ormetal nitrides can be used. In particular, an oxide of an alkali metal,an oxide of an alkaline-earth metal, an oxide of a rare-earth metal, anitride of an alkali metal, a nitride of an alkaline-earth metal, and anitride of a rare-earth metal are preferable because they are likely toexhibit an electron-donating property. Specifically, lithium oxide,strontium oxide, barium oxide, erbium oxide, lithium nitride, magnesiumnitride, calcium nitride, yttrium nitride, lanthanum nitride, and thelike are preferable. In particular, lithium oxide, barium oxide, lithiumnitride, magnesium nitride, and calcium nitride are preferable becausethey can be formed by vacuum evaporation and are easy to handle.

The electron-transporting layer 347 and the hole-transporting layer 346which are each formed of an organic compound with a light-emittingproperty and an inorganic compound are superior in electroninjecting/transporting properties. Therefore, various materials can beused for the first electrode 316 and the second electrode 319 withoutlimiting their work functions very much at all. Moreover, the drivevoltage can be reduced.

Further, the light-emitting element 321 functions as an inorganic ELelement by having a layer which uses an inorganic compound and which hasa light-emitting function (this layer is hereinafter referred to as alight-emitting layer 349) as the layer 318 containing a light-emittingsubstance. Inorganic EL elements are classified as dispersion-typeinorganic EL elements or thin-film inorganic EL elements, depending ontheir structure. They differ from one another in that the former includea light emitting layer in which particles of a light emitting materialare dispersed in a binder and the latter include a light emitting layerformed of a thin film of a light-emitting material. However, they sharethe fact that they both require electrons accelerated by a high electricfield. Further, mechanisms for obtaining light emission includedonor-acceptor recombination light emission, which utilizes a donorlevel and an acceptor level, and localized light emission, whichutilizes a core electron transition of a metal ion. In many cases,dispersion-type inorganic EL elements utilize donor-acceptorrecombination light emission, while thin-film inorganic EL elementsutilize localized light emission. A structure of an inorganic EL elementis described below.

A light-emitting material that can be used in this embodiment modeincludes a host material and an impurity element which serves as alight-emitting center. By varying the impurity element that is included,various colors of light emission can be obtained. Various methods can beused to manufacture the light-emitting material, such as a solid phasemethod or a liquid phase method (e.g., a coprecipitation method) can beused. Further, a liquid phase method, such as a spray pyrolysis method,a double decomposition method, a method which employs a pyrolyticreaction of a precursor, a reverse micelle method, a method in which oneor more of the above methods is combined with high-temperature baking, afreeze-drying method, or the like can be used.

In the solid phase method, the host material and an impurity element ora compound containing an impurity element are weighed, mixed in amortar, and reacted by being heated and baked in an electric furnace.Thereby, the impurity element is included in the host material. Bakingtemperature is preferably 700 to 1500° C. This is because if thetemperature is too low, the solid phase reaction will not proceed, andif the temperature is too high, the host material will decompose. Thematerials may be baked in powdered form. However, it is preferable tobake the materials in pellet form. Baking at a relatively hightemperature is necessary in the solid phase method. However, due to itssimplicity, this method has high productivity and is suitable for massproduction.

The liquid phase method (e.g., a coprecipitation method) is a method inwhich the host material or a compound containing the host material, andan impurity element or a compound containing an impurity element, arereacted in a solution, dried, and then baked. Particles of thelight-emitting material are distributed uniformly, and the reaction canproceed even if the particles are small and the baking temperature islow.

As a host material for the light-emitting material of the inorganic ELelement, a sulfide, an oxide, or a nitride can be used. As a sulfide,zinc sulfide, cadmium sulfide, calcium sulfide, yttrium sulfide, galliumsulfide, strontium sulfide, barium sulfide, or the like can be used, forexample. Further, as an oxide, zinc oxide, yttrium oxide, or the likecan be used, for example. Moreover, as a nitride, aluminum nitride,gallium nitride, indium nitride, or the like can be used, for example.Further, zinc selenide, zinc telluride, or the like can also be used. Aternary mixed crystal such as calcium gallium sulfide, strontium galliumsulfide, or barium gallium sulfide may also be used.

As a light-emitting center for localized light emission, manganese (Mn),copper (Cu), samarium (Sm), terbium (Th), erbium (Er), thulium (Tm),europium (Eu), cerium (Ce), praseodymium (Pr), or the like can be used.Further, as charge compensation, a halogen element such as fluorine (F)or chlorine (Cl) may be added.

Meanwhile, as a light-emitting center for donor-acceptor recombinationlight emission, a light-emitting material that includes a first impurityelement which forms a donor level and a second impurity element whichforms an acceptor level can be used. As the first impurity element,fluorine (F), chlorine (Cl), aluminum (Al), or the like can be used, forexample. As the second impurity element, copper (Cu), silver (Ag), orthe like can be used, for example.

In the case of using a solid phase method to synthesize a light-emittingmaterial for donor-acceptor recombination light emission, the hostmaterial, the first impurity element or a compound containing the firstimpurity element, and the second impurity element or a compoundcontaining the second impurity element are weighed, mixed in a mortar,then heated and baked in an electric furnace. As the host material, anyof the above-mentioned host materials can be used. As the first impurityelement, fluorine (F), chlorine (Cl), or the like can be used, forexample. As the compound containing the first impurity element, aluminumsulfide or the like can be used, for example. As the second impurityelement, copper (Cu), silver (Ag), or the like can be used, for example.As the compound containing the second impurity element, copper sulfide,silver sulfide, or the like can be used, for example. Baking temperatureis preferably 700 to 1500° C. This is because if the temperature is toolow, the solid phase reaction will not proceed, and if the temperatureis too high, the host material will decompose. Baking may be conductedwith the materials in powdered form; however, it is preferable toconduct baking with the materials in pellet form.

Further, in the case of employing a solid phase reaction, a compoundincluding the first impurity element and the second impurity element maybe used. In such a case, since the impurity elements diffuse readily andthe solid phase reaction proceeds readily, a uniform light-emittingmaterial can be obtained. Further, since an unnecessary impurity elementdoes not enter the light-emitting material, a light-emitting materialwith high purity can be obtained. As a compound including the firstimpurity element and the second impurity element, for example, copperchloride, silver chloride, or the like can be used.

Note that the concentration of the impurity elements in the hostmaterial may be 0.01 to 10 atomic percent, and is preferably in therange of 0.05 to 5 atomic percent.

FIG. 7C shows a cross-section of an inorganic EL element in which thelayer 318 containing a light-emitting substance is formed by a firstinsulating layer 348, a light emitting layer 349, and a secondinsulating layer 350.

In the case of thin film inorganic EL, the light emitting layer 349includes an above-mentioned light-emitting material. As a method forforming the light emitting layer 349, resistive heating evaporation, avacuum evaporation method such as an electron-beam evaporation (EBevaporation) method, a physical vapor deposition (PVD) method such as asputtering method, a chemical vapor deposition (CVD) method such as ametalorganic CVD method or a low-pressure hydride transport CVD method,an atomic layer epitaxy (ALE) method, or the like can be used.

There is no particular limitation on the materials used for the firstinsulating layer 348 and the second insulating layer 350; however,preferably they have a high insulating property and form a dense film.In addition, preferably the material of the insulating layers has a highdielectric constant. For example, silicon oxide, yttrium oxide, aluminumoxide, hafnium oxide, tantalum oxide, barium titanate, strontiumtitanate, lead titanate, silicon nitride, zirconium oxide, or the like,or a mixed film or a stacked film containing two or more of thesematerials can be used. The first insulating layer 348 and the secondinsulating layer 350 can be formed by sputtering, an evaporation method,CVD, or the like. There is no particular limitation on the thickness ofthe first insulating layer 348 and the second insulating layer 350, butpreferably it is in the range of 10 to 1000 nm. Note that a lightemitting element of this embodiment mode does not necessarily requirehot electrons, and therefore has the advantages that a thin film can beformed and drive voltage can be reduced. Film thickness is preferablyless than or equal to 500 nm, more preferably less than or equal to 100nm.

Although not shown, a buffer layer may be provided between thelight-emitting layer 349 and the insulating layers 348 and 350 orbetween the light-emitting layer 349 and the electrodes 316 and 319. Thebuffer layer facilitates carrier injection and suppresses mixture of thelayers. There is no particular limitation on the material of the bufferlayer. However, for example, zinc sulfide, selenium sulfide, cadmiumsulfide, strontium sulfide, barium sulfide, copper sulfide, lithiumfluoride, calcium fluoride, barium fluoride, magnesium fluoride, or thelike, which are host materials for the light-emitting layer, can beused.

Moreover, as shown in FIG. 7D, the layer 318 containing a light-emittingsubstance may be formed by the light-emitting layer 349 and the firstinsulating layer 348. In this case, in FIG. 7D, the first insulatinglayer 348 is provided between the second electrode 319 and thelight-emitting layer 349. Note that the first insulating layer 348 maybe provided between the first electrode 316 and the light-emitting layer349.

Further, the layer 318 containing a light-emitting substance may beformed by only the light-emitting layer 349. In other words, thelight-emitting element 321 may be formed by the first electrode 316, thelight-emitting layer 349, and the second electrode 319.

In the case of a dispersion-type inorganic EL element, a layercontaining a light-emitting substance which is the form of a film isformed by dispersing particles of light-emitting material in a binder.When particles with a desired size cannot be satisfactorily obtainedsatisfactorily by a method of manufacturing the light-emitting material,the material may be processed into particles by being crushed in amortar or the like. A binder refers to a material for fixing thedispersed particles of light-emitting material in place and maintainingthe shape of the layer containing a light-emitting substance. Thelight-emitting material is dispersed evenly throughout the layercontaining a light-emitting substance and fixed in place by the binder.

In the case of the dispersion-type inorganic EL element, the layercontaining a light-emitting substance can be formed by a dropletdischarge method that can selectively form the layer containing thelight-emitting substance, a printing method (such as screen printing oroffset printing), a coating method such as a spin coating method, adipping method, a dispenser method, or the like. There is no particularlimitation on the thickness of the layer. However, it is preferably inthe range of 10 to 1000 nm. Further, the proportion of thelight-emitting material in the layer containing a light-emittingsubstance, which includes the light-emitting material and the binder, ispreferably in the range of 50 to 80 wt %, inclusive.

An element shown in FIG. 7E has the first electrode 316, the layer 318containing a light-emitting substance, and the second electrode 319. Thelayer 318 containing a light-emitting substance is formed by theinsulating layer 348 and a light-emitting layer in which alight-emitting material 352 is dispersed in a binder 351. FIG. 7E showsa structure in which the insulating layer 348 is in contact with thesecond electrode 319; however, a structure in which the insulating layer348 is in contact with the first electrode 316 may also be used.Moreover, insulating layers may be formed in contact with each of thefirst electrode 316 and the second electrode 319 in the element.Further, the insulating layer does not have to be in contact with thefirst electrode 316 or the second electrode 319 in the element.

As a binder which can be used in this embodiment mode, an organicmaterial or an inorganic material can be used. A mixed materialcontaining an organic material and an inorganic material may also beused. As an organic insulating material, a polymer with a relativelyhigh dielectric constant, such as a cyanoethyl cellulose resin, or aresin such as polyethylene, polypropylene, a polystyrene resin, asilicone resin, an epoxy resin, or vinylidene fluoride can be used.Further, a siloxane resin or a heat-resistant macromolecular materialsuch as aromatic polyamide or polybenzimidazole may also be used. Asiloxane resin is a resin which includes a Si—O—Si bond. Siloxane is amaterial which has a backbone formed of bonds between silicon (Si) andoxygen (O). As a substituent, an organic group containing at leasthydrogen (for example, an alkyl group or an aryl group) can be used.Alternatively, a fluoro group may be used as a substituent. Furtheralternatively, both a fluoro group and an organic group containing atleast hydrogen may be used as a substituent. Further, the followingresin materials may also be used: a vinyl resin such as polyvinylalcohol or polyvinylbutyral, a phenol resin, a novolac resin, an acrylicresin, a melamine resin, a urethane resin, an oxazole resin (e.g.,polybenzoxazole), or the like. Further, a photocurable resin can beused. Fine particles with a high dielectric constant, such as particlesof barium titanate or strontium titanate, can be mixed with these resinsas appropriate to adjust the dielectric constant.

Further, the inorganic material used for the binder can be formed usingsilicon oxide, silicon nitride, silicon containing oxygen and nitrogen,aluminum nitride, aluminum containing oxygen and nitrogen, aluminumoxide, titanium oxide, barium titanate, strontium titanate, leadtitanate, potassium niobate, lead niobate, tantalum oxide, bariumtantalate, lithium tantalate, yttrium oxide, zirconium oxide, zincsulfide, or other substances containing an inorganic material. Byincluding an inorganic material with a high dielectric constant in theorganic material (by doping or the like), the dielectric constant of thelayer containing a light-emitting substance, which includes thelight-emitting material and the binder, can be further controlled, andthe dielectric constant can be further increased.

In the manufacturing process, the light-emitting material is dispersedin a solution containing a binder. As a solvent for the solutioncontaining a binder that can be used in this embodiment mode, a solventin which the binder material dissolves and which can form a solutionwith a viscosity that is suitable for the method of forming thelight-emitting layer (the various wet processes) and for a desired filmthickness may be selected appropriately. An organic solvent or the likecan be used. For example, when a siloxane resin is used as the binder,propylene glycolmonomethyl ether, propylene glycolmonomethyl etheracetate (also called PGMEA), 3-methoxy-3-methyl-1-butanol (also calledMMB), or the like can be used as the solvent.

In the inorganic EL light-emitting element, light emission is obtainedwhen a voltage is applied between a pair of electrodes which sandwichthe layer containing a light-emitting substance, and the element can beoperated by either direct current drive or alternating current drive.

Next, as shown in FIG. 5B, a protective film 322 is formed over thesecond electrode 319. The protective film 322 is to prevent moisture,oxygen, and the like from penetrating the light-emitting element 321 andthe protective film 322. The protective film 322 is preferably formedusing silicon nitride, silicon oxide, silicon nitride oxide, siliconoxynitride, aluminum oxynitride, aluminum oxide, diamond-like carbon(DLC), carbon containing nitrogen, or another insulating material, by athin-film formation method such as a plasma CVD method or a sputteringmethod.

Further, when a sealing substrate 324 is attached to the secondinterlayer insulating film 315, which is formed over the substrate 100,by using a sealant 323, the light-emitting element 321 is provided in aspace 325 which is enclosed by the substrate 100, the sealing substrate324, and the sealant 323. The space 325 is filled with filler, which maybe an inert gas (such as nitrogen or argon) or the sealant 323.

An epoxy-based resin is preferably used for the sealant 323. Further, itis desirable that the material of the sealant 323 transmits as littlemoisture and oxygen as possible. As the sealing substrate 324, a glasssubstrate, a quartz substrate, or a plastic substrate formed of FRP(fiberglass reinforced plastic), PVF (polyvinyl fluoride), a polyesterfilm, polyester, acrylic, or the like can be used.

Subsequently, as shown in FIG. 6C, an FPC 327 is attached to theconductive film 320 which is in contact with the connection terminal 314using an anisotropic conductive film 326, similarly to in EmbodimentMode 3.

Through the above steps, a semiconductor device having an active matrixlight-emitting element can be formed.

Here, FIG. 8 shows an equivalent circuit diagram of a pixel in a case offull-color display in this embodiment mode. In FIG. 8, a thin filmtransistor 331 which is surrounded by a dashed line corresponds to athin film transistor which switches the thin film transistor 227 fordriving in FIG. 6A, while a thin film transistor 332 which is surroundedby a dashed line corresponds to the thin film transistor 227 whichdrives a light-emitting element. In the following description, anorganic EL element (hereinafter referred to as an OLED) in which a layercontaining a light-emitting substance is formed by a layer containing anorganic compound with a light-emitting property is used as thelight-emitting element.

In a pixel which displays red color, an OLED 334R which emits red lightis connected to a drain region of the thin film transistor 332, and ananode-side power supply line 337R is provided in a source region of thethin film transistor 332. The OLED 334R is provided with a cathode-sidepower supply line 333. Further, the thin film transistor 331 forswitching is connected to a gate wiring 336, and a gate electrode of thethin film transistor 332 for driving is connected to a drain region ofthe thin film transistor 331 for switching. The drain region of the thinfilm transistor 331 for switching is connected to a capacitor 338 whichis connected to the anode-side power supply line 337R.

In a pixel displaying green color, an OLED 334G which emits green lightis connected to a drain region of the thin film transistor 332 fordriving, and an anode-side power supply line 337G is provided in asource region of the thin film transistor 332 for driving. The OLED 334Gis provided with the cathode-side power supply line 333. The thin filmtransistor 331 for switching is connected to the gate wiring 336, andthe gate electrode of the thin film transistor 332 for driving isconnected to the drain region of the thin film transistor 331 forswitching. The drain region of the thin film transistor 331 forswitching is connected to the capacitor 338 which is connected to theanode-side power supply line 337G.

In a pixel displaying blue color, an OLED 334B which emits blue light isconnected to a drain region of the thin film transistor 332 for driving,and an anode-side power supply line 337B is provided in a source regionof the thin film transistor 332 for driving. The OLED 334B is providedwith the cathode-side power supply line 333. The thin film transistor331 for switching is connected to the gate wiring 336, and the gateelectrode of the thin film transistor 332 for driving is connected tothe drain region of the thin film transistor 331 for switching. Thedrain region of the thin film transistor 331 for switching is connectedto the capacitor 338 which is connected to the anode-side power supplyline 337B.

Different voltages are applied to each of the pixels having differentcolors to one another, depending on the material of the layer containinga light-emitting substance.

Here, although a source wiring 335 and the anode-side power supply lines337R, 337G, and 337B are formed in parallel, the invention is notlimited to this. The gate wiring 336 and the anode-side power supplylines 337R, 337G, and 337B may be formed in parallel. Further, the thinfilm transistor 332 for driving may have a multi-gate electrodestructure.

In the light-emitting device, there is no particular limitation on thedriving method of the screen display. For example, a dot-sequentialdriving method, a line-sequential driving method, a plane-sequentialdriving method, or the like may be used. Typically, a line sequentialdriving method is used, and may be combined as appropriate with atime-division grayscale driving method or an area grayscale drivingmethod. Further, a video signal which is input to a source line of thelight emitting device may be an analog signal or a digital signal. Adriver circuit or the like may be designed as appropriate in accordancewith the video signal.

Further, for a light-emitting device using a digital video signal,driving methods include one in which video signals input to a pixel areones with a constant voltage (CV) and one in which video signals inputto a pixel are ones with a constant current (CC). Further, concerningthe driving method which employs video signals with a constant voltage(CV), there is a system in which voltage of a signal which is applied toa light emitting element is constant (CVCV), and a system in whichcurrent of a signal which is applied to a light emitting element isconstant (CVCC). Further, concerning the driving method which employsvideo signals with a constant current (CC), there is a system in whichvoltage of a signal which is applied to a light emitting element isconstant (CCCV), and a system in which current of a signal which isapplied to a light emitting element is constant (CCCC).

A protection circuit for preventing electrostatic breakdown (such as aprotection diode) may be provided in the light-emitting device.

Through the above steps, a light-emitting device having an active matrixlight-emitting element can be manufactured. In the light-emitting devicedescribed in this embodiment mode, the number of cracks that form in thesubstrate and the layer over the substrate during the manufacturingprocess can be reduced. Therefore, light emitting devices can bemanufactured with a high yield rate.

Embodiment Mode 4

In this embodiment mode, a manufacturing process of a semiconductordevice which is capable of non-contact data transmission will bedescribed with reference to FIGS. 9A to 12D. Further, a structure of thesemiconductor device will be described with reference to FIG. 13.Further, applications of the semiconductor device described in thisembodiment mode will be described with reference to FIGS. 14A to 14F.

As shown in FIG. 9A, a separation film 402 is formed over a substrate401. Next, an insulating film 403 is formed over the separation film402, and thereby a thin film transistor 404 is formed over theinsulating film 403. Next, an interlayer insulating film 405 is formedto insulate a conductive film included in the thin film transistor 404,and source and drain electrodes 406 which are connected to asemiconductor film of the thin film transistor 404 are formed. Afterthat, an insulating film 407 which covers the thin film transistor 404,the interlayer insulating film 405, and the source and drain electrodes406 is formed. Then, a conductive film 408 which is connected to thesource electrode 406 or the drain electrode 406 with the insulating film407 interposed therebetween is formed.

As the substrate 401, a substrate similar to the substrate 100 can beused. Further, a metal substrate which has an insulating film formed onone surface, a stainless-steel substrate which has an insulating filmformed on one surface, a plastic substrate which has heat resistance andwhich can withstand the treatment temperature of this process, a ceramicsubstrate, or the like can be used. Here, a glass substrate is used asthe substrate 401.

The separation film 402 is formed of tungsten (W), molybdenum (Mo),titanium (Ti), tantalum (Ta), niobium (Nb), nickel (Ni), cobalt (Co),zirconium (Zr), zinc (Zn), ruthenium (Ru), rhodium (Rh), palladium (Pd),osmium (Os), iridium (Ir), or silicon; an alloy material containing anabove-mentioned element as its main component; or a compound materialcontaining an above-mentioned element as its main component, and has asingle-layer or a stacked-layer structure. A sputtering method, a plasmaCVD method, a coating method, a printing method, or the like is used toform the separation film 402. The crystal structure of a separation filmincluding silicon may be amorphous, microcrystalline, orpolycrystalline.

When the separation film 402 has a single-layer structure, it ispreferable to form a layer including tungsten or molybdenum, or a layerincluding a mixture of tungsten and molybdenum. Alternatively, a layerincluding an oxide of tungsten or tungsten oxynitride, a layer includingmolybdenum oxide or molybdenum oxynitride, or a layer including an oxideor an oxynitride of a mixture of tungsten and molybdenum is formed. Themixture of tungsten and molybdenum corresponds to, for example, an alloyof tungsten and molybdenum.

When the separation film 402 has a stacked-layer structure, a layerincluding tungsten or molybdenum or a layer including a mixture oftungsten and molybdenum is preferably formed as a first layer, and alayer including an oxide, a nitride, an oxynitride, or a nitride oxideof tungsten, molybdenum, or a mixture of tungsten and molybdenum ispreferably formed as a second layer.

When the separation film 402 is formed as a stacked-layer structureincluding a layer which includes tungsten and a layer which includes anoxide of tungsten, the layer which includes tungsten may be formed andan insulating layer which includes an oxide may be formed thereover sothat the layer which includes an oxide of tungsten is formed at theinterface of the tungsten layer and the insulating layer. Further, thelayer which includes an oxide of tungsten may be formed by processing asurface of the layer which includes tungsten using thermal oxidationtreatment, oxygen plasma treatment, N₂O plasma treatment, treatmentusing a solution with strong oxidizing power, such as ozone water,treatment using water to which hydrogen has been added, or the like.This also applies when forming a layer including tungsten nitride, alayer including tungsten oxynitride, and a layer including tungstennitride oxide. After forming the layer which includes tungsten, asilicon nitride layer, a silicon oxynitride layer, and a silicon nitrideoxide layer are preferably formed over the layer which includestungsten.

An oxide of tungsten oxide is represented by WO_(x), where x satisfies2≦x≦3. The x may be 2 (WO₂), 2.5 (W₂O₅), 2.75 (W₄O₁₁), 3 (WO₃), or thelike.

Here, the tungsten film is formed by a sputtering method to a thicknessof 20 to 100 nm, preferably 40 to 80 nm.

Although the separation film 402 is formed such that it is in contactwith the substrate 401 in the above process, the invention is notlimited to this process. An insulating film which serves as a base maybe formed such that it is in contact with the substrate 401 and theseparation film 402 may be provided such that it is in contact with theinsulating film.

The insulating film 403 can be formed in a similar manner to theinsulating film 101. Here, the insulating film is formed by generatingplasma in the flow of N₂O gas to form a tungsten oxide film on a surfaceof the separation film 402, and then forming a silicon oxide filmincluding nitrogen by a plasma CVD method.

The thin film transistor 404 can be formed in a similar manner to thethin film transistors 225 to 227 described in Embodiment Mode 2. Thesource and drain electrodes 406 can be formed similarly to the wirings234 to 239 described in Embodiment Mode 2.

The interlayer insulating film 405 and the insulating film 407 can beformed by applying and baking a polyimide, an acrylic, or a siloxanepolymer. Alternatively, they may be formed using an inorganic compound,by a sputtering method, a plasma CVD method, a coating method, aprinting method, or the like, as a single layer or a stacked layer.Representative examples of the inorganic compound include silicon oxide,silicon nitride, and silicon oxynitride.

Next, as shown in FIG. 9B, a conductive film 411 is formed over theconductive film 408. Here, a composition including gold particles isprinted by a printing method and heated at 200° C. for 30 minutes sothat the composition is baked. Thus, the conductive film 411 is formed.

Next, as shown in FIG. 9C, an insulating film 412 which covers endportions of the insulating film 407 and the conductive film 411 isformed. Here, the insulating film 412 which covers end portions of theinsulating film 407 and the conductive film 411 is formed using an epoxyresin. An epoxy resin composition is applied by a spin coating methodand heated at 160° C. for 30 minutes. Then, a part of the insulatingfilm which covers the conductive film 411 is removed to expose theconductive film 411. Thus, the insulating film 412 with a thickness of 1to 20 μm, preferably 5 to 10 μm, is formed. Here, a stacked-layer bodyincluding from the insulating film 403 to the insulating film 412 isreferred to as an element-forming layer 410.

Next, as shown in FIG. 9D, the insulating films 403, 405, 407, and theinsulating film 412 are irradiated with a laser beam 413 to form openingportions 414 such as those shown in FIG. 9E, in order to facilitate asubsequent separation step. Next, an adhesive member 415 is attached tothe insulating film 412. The laser beam used to irradiate to form theopening portions 414 is preferably a laser beam with a wavelength thatis absorbed by the insulating films 403, 405, 407, and the insulatingfilm 412. Typically, a laser beam of an ultraviolet region, a visibleregion, or an infrared region is selected as appropriate and used toirradiate.

As a laser oscillator capable of emitting such a laser beam, an excimerlaser such as an ArF excimer laser, a KrF excimer laser, or a XeClexcimer laser, or a laser oscillator similar to the laser oscillators 11a and 11 b described in Embodiment Mode 1 can be used as appropriate.Note that in the case of using a solid-state laser, preferably any oneof the fundamental wave to the fifth harmonic is used, as appropriate.As a result of the laser irradiation, the insulating films 403, 405,407, and 412 absorb the laser beam and melt, and thereby the openingportions are formed.

Note that when the process step of irradiating the insulating films 403,405, 407, and 412 with the laser beam is omitted, throughput can beimproved.

Next, as shown in FIG. 1A, a part 421 of the element-forming layer isseparated from the substrate 401 having the separation film by aphysical means at a metal oxide film formed at the interface of theseparation film 402 and the insulating film 403. A ‘physical means’ hererefers to a dynamic means or a mechanical means which changes some kindof dynamic energy (or mechanical energy). A typical physical meansrefers to the application of mechanical power (for example, pulling by ahuman hand or a gripping tool, or separating while rolling a roller,using the roller as a fulcrum).

In this embodiment mode, a method is used in which a metal oxide film isformed between a separation film and an insulating film and a physicalmeans is used to separate the part 421 of the element-forming layer atthe metal oxide film. However, the invention is not limited to this. Amethod can be used in which a light-transmitting substrate is used asthe substrate and an amorphous silicon layer containing hydrogen is usedas the separation film. In such a method, subsequent to the process stepin FIG. 9E, the amorphous silicon film is irradiated with a laser beamfrom the substrate side to vaporize hydrogen contained in the amorphoussilicon film, and separation occurs between the substrate and theseparation film.

Further, subsequent to the process step in FIG. 9E, alternatively, amethod of removing the substrate by mechanical polishing, or a method ofremoving the substrate by using a solution such as HF which dissolvesthe substrate can be employed. In such a case, it is not necessary touse a separation film.

Further, a method can be used in which before attaching the adhesivemember 415 to the insulating film 412 in FIG. 9E, a halogen fluoride gassuch as NF₃, BrF₃, or ClF₃ is introduced into the opening portions 414so that the separation film is etched away by the halogen fluoride gas;then, the adhesive member 415 is attached to the insulating film 412;and then, the part 421 of the element-forming layer is separated fromthe substrate.

Further, a method can be used in which before attaching the adhesivemember 415 to the insulating film 412 in FIG. 9E, a halogen fluoride gassuch as NF₃, BrF₃, or ClF₃ is introduced into the opening portions 414so that the separation film is partially etched away by the halogenfluoride gas; then, the adhesive member 415 is attached to theinsulating film 412; and then, the part 421 of the element-forming layeris separated from the substrate by a physical means.

Next, as shown in FIG. 10B, a flexible substrate 422 is attached to theinsulating film 403 in the part 421 of the element-forming layer. Then,the adhesive member 415 is separated from the part 421 of theelement-forming layer. Here, a film formed of polyaniline by a castmethod is used as the flexible substrate 422.

Then, the flexible substrate 422 is attached to a UV sheet 431 of adicing frame 432, as shown in FIG. 10C. Since the UV sheet 431 isadhesive, the flexible substrate 422 is fixed on the UV sheet 431.Subsequently, the conductive film 411 may be irradiated with a laserbeam to increase adhesiveness between the conductive film 411 and theconductive film 408.

Next, a connection terminal 433 is formed over the conductive film 411,as shown in FIG. 10D. By forming the connection terminal 433, alignmentand adhesion with the conductive film which subsequently functions as anantenna can be conducted easily.

Next, as shown in FIG. 11A, the part 421 of the element-forming layer isdivided into parts. Here, the part 421 of the element-forming layer isdivided into plural parts, as shown in FIG. 11B, by irradiating the part421 of the element-forming layer and the flexible substrate 422 with alaser beam 434. As the laser beam 434, any of the laser beams describedabove which may be used for the laser beam 413 can be used asappropriate. Here, preferably a laser beam which can be absorbed by theinsulating films 403, 405, and 407, the insulating film 412, and theflexible substrate 422 is selected. Note that although the part of theelement-forming layer is divided into plural parts by a laser cut methodhere, a dicing method, a scribing method, or the like can be usedinstead as appropriate. The element-forming layer which has been dividedinto parts is shown as thin film integrated circuits 442 a and 442 b.

Next, as shown in FIG. 11C, the UV sheet of the dicing frame 432 isirradiated with UV light to decrease the adhesiveness of the UV sheet431. Then, the UV sheet 431 is supported by an expander frame 444. Atthis time, by supporting the UV sheet 431 with the expander frame 444while stretching the UV sheet 431, the width of a groove 441 which isformed between the thin film integrated circuits 442 a and 442 b can beincreased. Note that preferably an expanded groove 446 corresponds tothe size of an antenna substrate which is subsequently attached to thethin film integrated circuits 442 a and 442 b.

Next, as shown in FIG. 12A, a flexible substrate 456 having conductivefilms 452 a and 452 b which function as antennas is attached to the thinfilm integrated circuits 442 a and 442 b using anisotropic conductiveadhesives 455 a and 455 b. Note that the flexible substrate 456 havingthe conductive films 452 a and 452 b which function as antennas isprovided with opening portions so as to partially expose the conductivefilms 452 a and 452 b. Accordingly, the flexible substrate 456 isattached to the thin film integrated circuits 442 a and 442 b whileadjusting their positions such that the conductive films 452 a and 452 bwhich function as antennas are connected to connection terminals of thethin film integrated circuits 442 a and 442 b by conductive particles454 a and 454 b which are included in the anisotropic conductiveadhesives 455 a and 455 b.

Here, the conductive film 452 a which functions as an antenna isconnected to the thin film integrated circuit 442 a by the conductiveparticles 454 a within the anisotropic conductive adhesive 455 a, whilethe conductive film 452 b which functions as an antenna is connected tothe thin film integrated circuit 442 b by the conductive particles 454 bwithin the anisotropic conductive adhesive 455 b.

Subsequently, as shown in FIG. 12B, the flexible substrate 456 and aninsulating film 453 are divided into parts in a region where theconductive films 452 a and 452 b which function as antennas and the thinfilm integrated circuits 442 a and 442 b are not formed. Here, they aredivided into parts by a laser cutting method in which the insulatingfilm 453 and the flexible substrate 456 are irradiated with a laser beam461.

In accordance with the above steps, semiconductor devices 462 a and 462b which are capable of non-contact data transmission can bemanufactured, as shown in FIG. 12C.

Note that a semiconductor device 464 such as the one shown in FIG. 11Dmay be manufactured in such a way that the flexible substrate 456 havingthe conductive films 452 a and 452 b which function as antennas isattached to the thin film integrated circuits 442 a and 442 b using theanisotropic conductive adhesives 455 a and 455 b in FIG. 12A; then, aflexible substrate 463 is provided so as to seal the flexible substrate456 and the thin film integrated circuits 442 a and 442 b; and theregion where the conductive films 452 a and 452 b which function asantennas and the thin film integrated circuits 442 a and 442 b are notformed is irradiated with the laser beam 461, as shown in FIG. 12B. Inthis case, the thin film integrated circuits are sealed by the flexiblesubstrates 456 and 463 which have been divided into parts. Therefore,deterioration of the thin film integrated circuits can be suppressed.

In accordance with the above steps, thin and lightweight semiconductordevices can be manufactured with a high yield. In the semiconductordevice described in this embodiment mode, the number of cracks that formin the substrate and the layer over the substrate during themanufacturing process can be reduced. Therefore, semiconductor devicescan be manufactured with a high yield.

Next, a structure of the above-mentioned semiconductor device which iscapable of non-contact data transmission will be described, withreference to FIG. 13.

The semiconductor device of this embodiment mode includes an antennaportion 2001, a power supply portion 2002, and a logic portion 2003 asits main components.

The antenna portion 2001 includes an antenna 2011 which receivesexternal signals and transmits data. The signal transmission method ofthe semiconductor device can be an electromagnetic coupling method, anelectromagnetic induction method, a microwave method, or the like. Thetransmission method may be selected as appropriate taking an intendeduse of the device into account, and an antenna which is suitable for thetransmission method may be provided.

The power supply portion 2002 includes a rectifier circuit 2021 whichproduces power based on a signal received from the outside through theantenna 2011 and a storage capacitor 2022 for storing the producedpower.

The logic portion 2003 includes a demodulation circuit 2031 whichdemodulates a received signal, a clock generating/compensating circuit2032 which generates a clock signal, a code recognition anddetermination circuit 2033, a memory controller 2034 which produces asignal for reading data from a memory based on a received signal, amodulation circuit 2035 for changing an encoded signal to a receivedsignal, an encoder circuit 2037 which encodes the read data, and a maskROM 2038 which stores data. Further, the modulation circuit 2035 has aresistor 2036 for modulation.

A code recognized and determined by the code recognition anddetermination circuit 2033 is a frame termination signal (EOF, End ofFrame), a frame starting signal (SOF, Start of Frame), a flag, a commandcode, a mask length, a mask value, or the like. The code recognition anddetermination circuit 2033 also has a cyclic redundancy check (CRC)function for identifying transmission errors.

Next, applications of the above-described semiconductor device which iscapable of non-contact data transmission will be described withreference to FIGS. 14A to 14F. The above-described semiconductor devicewhich is capable of non-contact data transmission has a wide range ofapplications, such as bills, coins, securities, bearer bonds, documents(e.g., driver's licenses or resident's cards; see FIG. 14A), packagingcontainers (e.g., wrapping paper or bottles; see FIG. 14C), storagemedia (e.g., DVD software or video tapes; see FIG. 14B), means oftransportation (e.g., bicycles; see FIG. 14D), personal belongings(e.g., shoes or glasses), food, plants, animals, clothing, dailycommodities, or tags on goods such as electronic devices or on bags (seeFIGS. 14E and 14F). An electronic device is, for example, a liquidcrystal display device, an EL display device, a television device (alsoreferred to as simply a television, or as a TV receiver or a televisionreceiver), a portable telephone, or the like.

The semiconductor device 9210 of this embodiment mode may be fixed to anarticle by being mounted on a printed board, attached to a surface ofthe article, embedded in the article, and so on. For example, if theproduct is a book, the semiconductor device may be fixed to the book byembedding it inside paper of the book, and if the product is a packagemade of an organic resin, the semiconductor device may be fixed to thepackage by being embedded inside the organic resin. Since thesemiconductor device 9210 of this embodiment mode can be compact, thin,and lightweight, the design quality of the article itself is notdegraded even after the device is fixed to the article. Further, byproviding bills, coins, securities, bearer bonds, documents, and thelike with the semiconductor device 9210 of this embodiment mode, theycan be provided with an identification function, and forgery can beprevented by making use of the identification function. Moreover, whenthe semiconductor device of this embodiment mode is provided incontainers for packaging, recording media, personal belongings, food,clothes, daily commodities, electronic appliances, and the like, systemssuch as inspection systems can be made more efficient.

Embodiment Mode 5

Examples which can be given of electronic appliances having asemiconductor device described in a preceding embodiment mode includetelevision devices (also referred to as simply televisions, or astelevision receivers), cameras, such as digital cameras or digital videocameras, portable telephone devices (also referred to as simply portabletelephones, or mobile phones), portable information terminals such asPDAs, portable game machines, monitors for computers, computers, soundreproducing devices, such as car audio devices, image reproducingdevices equipped with a recording medium, such as home-use gamemachines, or the like. Specific examples of these are described withreference to FIGS. 15A to 15F.

A portable information terminal shown in FIG. 15A includes a main body9201, a display portion 9202, and the like. By employing a semiconductordevice described in a preceding embodiment mode in the display portion9202, a portable information terminal capable of high-definition displaycan be provided at a low price.

A digital video camera shown in FIG. 15B includes a display portion9701, a display portion 9702, and the like. By employing a semiconductordevice described in a preceding embodiment mode in the display portion9701, a digital video camera capable of high-definition display can beprovided at a low price.

A portable terminal shown in FIG. 15C includes a main body 9101, adisplay portion 9102, and the like. By employing a semiconductor devicedescribed in a preceding embodiment mode in the display portion 9102, aportable terminal with high reliability can be provided at a low price.

A portable television device shown in FIG. 15D includes a main body9301, a display portion 9302, and the like. By employing a semiconductordevice described in a preceding embodiment mode in the display portion9302, a portable television device capable of high-definition displaycan be provided at a low price. Such a television device can be appliedto a wide range of television devices, from small-sized devices that aremounted on portable terminals such as portable phones to medium-sizeddevices that are portable and large-sized devices (for example, 40inches or more).

A portable computer shown in FIG. 15E includes a main body 9401, adisplay portion 9402, and the like. By employing a semiconductor devicedescribed in a preceding embodiment mode in the display portion 9402, aportable computer capable of high-definition display can be provided ata low price.

A television device shown in FIG. 15F includes a main body 9501, adisplay portion 9502, and the like. By employing a semiconductor devicedescribed in a preceding embodiment mode in the display portion 9502, atelevision device capable of high-definition display can be provided ata low price.

A structure of the television device will now be described, withreference to FIG. 16.

FIG. 16 is a block diagram showing the main structure of the televisiondevice. A tuner 9511 receives a video signal and an audio signal. Thevideo signal is processed through a video detection circuit 9512, avideo signal processing circuit 9513 which converts the signal outputtedfrom the video detection circuit 9512 into a color signal correspondingto red, green, or blue, and a control circuit 9514 for converting thevideo signal in accordance with input specifications of a driver IC. Thecontrol circuit 9514 outputs signals to a scanning line driver circuit9516 and a signal line driver circuit 9517 of a display panel 9515. In acase where digital driving is used, a signal dividing circuit 9518 maybe provided on a signal line side so that the inputted digital signal isdivided into m number of signals to be supplied.

Of the signals received by the tuner 9511, the audio signal is sent toan audio detection circuit 9521 and its output is supplied to a speaker9523 through an audio signal processing circuit 9522. The controlcircuit 9524 receives control information such as a receiving station (areceiving frequency) and sound volume from an input portion 9525, andsends signals to the tuner 9511 and the audio signal processing circuit9522.

By forming the television device so as to include the display panel9515, the television device can have low power consumption. Further, atelevision device which can display high-definition images can bemanufactured.

The present invention is not limited to television receivers, and can beapplied to various uses, for example to display mediums, particularlyones with a large area, such as an information display board at arailway station, an airport, or the like, or an advertisement displayboard on the street, as well as to monitors of personal computers.

Next, a portable phone appliance is described as a mode of an electronicappliance to which the semiconductor device of the invention is mounted,with reference to FIG. 17. The portable phone appliance includes cases2700 and 2706, a display panel 2701, a housing 2702, a printed wiringboard 2703, operation buttons 2704, and a battery 2705 (see FIG. 17).The display panel 2701 is detachably incorporated into the housing 2702,and the housing 2702 is fitted to the printed wiring board 2703. Theshape and size of the housing 2702 are changed as appropriate inaccordance with the electronic appliance into which the display panel2701 is incorporated. A plurality of semiconductor devices that arepackaged are mounted on the printed wiring board 2703. A semiconductordevice of the invention can be used as one of them. The plurality ofsemiconductor devices mounted on the printed wiring board 2703 havefunctions such as the function of a controller, a central processingunit (CPU), a memory, a power supply circuit, an audio processingcircuit, a sending/receiving circuit, or the like.

The display panel 2701 is connected to the printed wiring board 2703with a connection film 2708 interposed therebetween. The display panel2701, the housing 2702, and the printed wiring board 2703 are housed inthe cases 2700 and 2706, together with the operation buttons 2704 andthe battery 2705. A pixel region 2709 in the display panel 2701 isdisposed such that it can be observed through a window opening providedin the case 2700.

In the display panel 2701, a pixel portion and one or more peripheraldriver circuits (in a plurality of driver circuits, the driver circuitswhich have a low operating frequency) may be formed over one substrateusing TFTs, whereas some other peripheral driver circuits (in aplurality of driver circuits, the driver circuits which have a highoperating frequency) may be formed over an IC chip. The IC chip may bemounted on the display panel 2701 using COG (chip on glass) technology,or the IC chip may be connected to a glass substrate by using TAB (tapeautomated bonding) or a printed board. Note that FIG. 18A shows anexample of a structure of a display panel in which a pixel portion and apart of a peripheral driver circuit are formed over one substrate and anIC chip including the other part of the peripheral driver circuit ismounted by COG or the like. The display panel shown in FIG. 18A includesa substrate 3900, a signal line driver circuit 3901, a pixel portion3902, a scanning line driver circuit 3903, a scanning line drivercircuit 3904, an FPC 3905, an IC chip 3906, an IC chip 3907, a sealingsubstrate 3908, and a sealant 3909. By employing such a structure, thepower consumption of a display device can be reduced, and a portablephone appliance can be used for a longer period per charge. Further, thecost of a portable phone appliance can be reduced.

In order to further reduce power consumption, a pixel portion may beformed over a substrate using TFTs and all the peripheral drivingcircuits may be formed over an IC chip, and then the IC chip may bemounted on a display panel using COG (chip on glass) technology, or thelike, as shown in FIG. 18B. A display panel shown in FIG. 18B includes asubstrate 3910, a signal line driver circuit 3911, a pixel portion 3912,a scanning line driver circuit 3913, a scanning line driver circuit3914, an FPC 3915, an IC chip 3916, an IC chip 3917, a sealing substrate3918, and a sealant 3919.

As described above, a semiconductor device of the invention is compact,thin, and lightweight. With these features, the limited space within thecases 2700 and 2706 of the electronic appliance can be used efficiently.Further, cost reduction is possible, and an electronic appliance havinga semiconductor device with high reliability can be manufactured.

Embodiment 1

In this embodiment, substrates in which cracks easily form whenirradiation with a laser beam is performed will be described. Further,concerning the substrates, the total stress after heating (a calculatedvalue) of layers including a semiconductor film which are formed overthe substrates, and the occurrence or non-occurrence of crack formationafter heating will be described.

First, the formation of cracks when a layer including a semiconductorfilm is irradiated with a laser beam after being formed over asubstrate, and types of substrate will be described with reference toFIG. 19.

A layer including a semiconductor film was formed over each of asubstrate 1, a substrate 2, and a substrate 3. Here, as the layerincluding a semiconductor film, a silicon nitride oxide film with athickness of 50 nm, a silicon oxynitride film with a thickness of 100nm, and an amorphous silicon film with a thickness of 66 nm were eachformed by a plasma CVD method in that order.

An EAGLE2000 substrate (manufactured by Corning, Inc.) with a thicknessof 0.7 mm was used as the substrate 1, an AN100 substrate (manufacturedby Asahi Glass Co., Ltd) with a thickness of 0.7 mm was used as thesubstrate 2, and an AQ (quartz) substrate (manufactured by Asahi GlassCo., Ltd) with a thickness of 0.7 mm was used as the substrate 3.

The thermal expansion coefficient of each substrate is shown in Table 1and FIG. 19.

[Table 1]

Film formation conditions for each of the silicon nitride oxide film,the silicon oxynitride film, and the amorphous silicon film are shown inTable 2.

[Table 2]

Next, the substrates 1 to 3 were heated at 500° C. for one hour in afurnace, and then heated at 550° C. for four hours.

Next, the substrates 1 to 3 were irradiated with a laser beam.Concerning the irradiating conditions of the laser beam at this time, asa laser oscillator, a second harmonic of an Nd:YVO₄ laser was used,scanning speed was 35 cm/sec, power was 18 W, and the number of timesscanned was ten.

The presence or otherwise of cracks in the substrates 1 to 3 and theaverage number of cracks in the substrates 1 to 3 are shown in Table 3.At this time the average number of cracks refers to the average numberof cracks per scan in an end portion of the substrate and the averagenumber of cracks per scan 1 cm inside the end portion of the substrate.

[Table 3]

From FIG. 19, Table 1, and Table 3, it can be seen that in thesubstrates having a thermal expansion coefficient of greater than6×10⁻⁷/° C. and less than or equal to 38×10⁻⁷/° C., preferably greaterthan 6×10⁻⁷/° C. and less than or equal to 31.8×10⁻⁷/° C., when a layerincluding a semiconductor film was formed, heating was performed, andsubsequently irradiation with a laser beam was performed, a crack formedin the substrate and the layer including a semiconductor film.

Next, we investigated conditions of a layer including a semiconductorfilm in a substrate having a thermal expansion coefficient of greaterthan 6×10⁻⁷/° C. and less than or equal to 38×10⁻⁷/° C., preferablygreater than 6×10⁻⁷/° C. and less than or equal to 31.8×10⁻⁷/° C., inwhich cracks did not form in the substrate and the layer including asemiconductor film even when the layer including a semiconductor filmwas formed, then heating was performed, and subsequently irradiationwith a laser beam was performed. The results are described below, withreference to FIGS. 20A to 20C, FIG. 21, and FIG. 22.

AN100 substrates (manufactured by Asahi Glass Co., Ltd) with a thermalexpansion coefficient of 38×10⁻⁷/° C. and a thickness of 0.7 mm wereused as substrates, and a layer including a semiconductor film wasformed over each of the substrates. Heating was performed, andsubsequently irradiation with a laser beam was performed. Therelationship between whether or not cracks formed in the substrate andthe layer including a semiconductor film at this time and the totalstress of the layer including a semiconductor film, which was calculatedfrom the film stresses and film thicknesses of films included in thelayer including a semiconductor film, is shown in FIG. 21.

Concerning FIG. 21, Sample 1 had a structure 510 shown in FIG. 20A. Overa substrate 501, as the layer including a semiconductor film, a siliconnitride oxide film 502 with a thickness of 140 nm, a silicon oxynitridefilm 503 with a thickness of 100 nm, and an amorphous silicon film 504with a thickness of 66 nm were each formed by a plasma CVD method inthat order.

Samples 2 to 9 had a structure 520 shown in FIG. 20B. Over a substrate501, as the layer including a semiconductor film, a silicon nitrideoxide film 512 with a thickness of 50 nm, a silicon oxynitride film 503with a thickness of 100 nm, and an amorphous silicon film 504 with athickness of 66 nm were each formed by a plasma CVD method in thatorder.

Sample 10 had a structure 530 shown in FIG. 20C. Over a substrate 501,as the layer including a semiconductor film, a silicon oxynitride film503 with a thickness of 100 nm and an amorphous silicon film 504 with athickness of 66 nm were each formed by a plasma CVD method in thatorder.

Film formation conditions for Samples 1 to 10 are shown in Table 4.

[Table 4]

In addition, each film included in the layers including a semiconductorfilm in Samples 1 to 10 was formed over a separate silicon substrate.For each of these films, Table 5 shows the post-formation film stressand the film stress after heat treatment was performed at 650° C. forsix minutes. Further, Table 5 shows values of the total stress of layersincluding a semiconductor film, which were calculated from thepost-formation film stresses and film thicknesses. Also shown in Table 5are values of the total stress of layers including a semiconductor filmwhich are formed over substrates, which were calculated from the filmstresses and film thicknesses from when after heating was performed at650° C. for six minutes. Further, values of the total stress of layersincluding a semiconductor film which were calculated from thepost-formation film stresses and film thicknesses of the films includedin the layers including a semiconductor film in Samples 1 to 10, whichwere each formed over separate silicon substrates, are shown bytriangular symbols in FIG. 21. Further, values of the total stress oflayers including a semiconductor film which are formed over substrates,which were calculated from the film stresses and film thicknesses fromwhen after the Samples 1 to 10 were heated at 650° C. for six minutes,are shown by black dots in FIG. 21. Note that the total stress S of thelayers including a semiconductor film was calculated using MathematicalFormula 1 shown above.

[Table 5]

Changes in the total stress of the layers including a semiconductor filmafter heating such as those shown in Table 5 are mainly due to the filmformation conditions and film densities of the silicon nitride oxidefilms 502 and 512. When the silicon nitride oxide films 502 and 512 areformed with conditions which result in them being formed as dense films,the film stress of the silicon nitride oxide films 502 and 512 afterheating is likely to be compressive stress. Further, comparing the filmstress of the silicon oxynitride film and the amorphous silicon filmbefore they are heated and after they are heated, there is not muchchange in the film stress. Therefore, due to the film stress of thesilicon nitride oxide film becoming compressive stress, the total stressof the layer including a semiconductor film after heating becomes lessthan 0 N/m, preferably less than or equal to −16 N/m, so it becomescompressive stress.

As shown in FIG. 21, in Samples 1 to 7, a crack formed in the substrateand the layer including a semiconductor film. Meanwhile, in Samples 8 to10, a crack did not form in the substrate and the layer including asemiconductor film.

From FIG. 21 and Table 5, it can be seen that when layers including asemiconductor film which have a total stress after heating of less than0 N/m, preferably less than or equal to −16 N/m, are formed over AN100substrates (manufactured by Asahi Glass Co., Ltd) with a thermalexpansion coefficient of 38×10⁻⁷/° C. and a thickness of 0.7 mm, evenwhen the layers including a semiconductor film are irradiated with alaser beam, a crack does not form in the substrates and the layersincluding a semiconductor film.

Further, when the total stress after heating of the layer including asemiconductor film, which is formed over the substrate, is less than−150 N/m, particularly less than −500 N/m, a problem occurs in that thelayer including a semiconductor film peels from the substrate.Therefore, it is desirable that the total stress after heating of thelayer including a semiconductor film, which is formed over thesubstrate, is a total stress after heating at which the layer includinga semiconductor film does not peel from the substrate, that is, greaterthan or equal to −500 N/m, preferably, greater than or equal to −150N/m.

Next, EAGLE2000 substrates (manufactured by Corning, Inc.) with athermal expansion coefficient of 31.8×10⁻⁷/° C. and a thickness of 0.7mm were used as substrates. FIG. 22 shows the relationship betweenwhether or not cracks formed in the substrate and a layer including asemiconductor film, which was formed over the substrate, when the layerincluding a semiconductor film was irradiated with a laser beam afterbeing heated, and the total stress, calculated from the film stressesand film thicknesses of the films included in the layer including asemiconductor film.

Sample 11 had the structure 510 of FIG. 20A. A silicon nitride oxidefilm 502 with a thickness of 140 nm, a silicon oxynitride film 503 witha thickness of 100 nm, and an amorphous silicon film 504 with athickness of 66 nm were each formed by a plasma CVD method in that orderover a substrate 501 as the layer including a semiconductor film.

Samples 12 to 15 had the structure 520 of FIG. 20B. A silicon nitrideoxide film 512 with a thickness of 50 nm, a silicon oxynitride film 503with a thickness of 100 nm, and an amorphous silicon film 504 with athickness of 66 nm were each formed by a plasma CVD method in that orderover a substrate 501 as the layer including a semiconductor film.

Sample 16 had the structure 530 of FIG. 20C. A silicon oxynitride film503 with a thickness of 100 nm and an amorphous silicon film 504 with athickness of 66 nm were each formed by a plasma CVD method in that orderover a substrate 501 as the layer including a semiconductor film.

Film formation conditions for Samples 11 to 16 are shown in Table 4above.

In addition, each film included in the layers including a semiconductorfilm in Samples 11 to 16 was formed over a separate silicon substrate.For each of these films, Table 6 shows the post-formation film stressand the film stress after heat treatment was performed at 650° C. forsix minutes. Further, Table 6 shows values of the total stress of layersincluding a semiconductor film which were calculated from thepost-formation film stresses and film thicknesses. Also shown in Table 6are values of the total stress of layers including a semiconductor filmwhich are formed over substrates, which were calculated from the filmstresses and film thicknesses from when after heating was performed at650° C. for six minutes. Further, values of the total stress of layersincluding a semiconductor film which were calculated from thepost-formation film stresses and film thicknesses of the films in thesamples, which were each formed over separate silicon substrates, areshown by triangular symbols in FIG. 22. Further, values of the totalstress of layers including a semiconductor film which are formed oversubstrates, which were calculated from the film stresses and filmthicknesses from when after the Samples 11 to 16 were heated at 650° C.for six minutes, are shown by black dots in FIG. 22.

[Table 6]

Changes in the total stress of the layers including a semiconductor filmafter heating such as those shown in Table 6 are mainly due to the filmformation conditions and film densities of the silicon nitride oxidefilms 502 and 512. When the silicon nitride oxide films 502 and 512 areformed with conditions such as a slow film formation speed or a hightemperature, for example, a dense film results. As a result, the valueof the total stress at which the layer including a semiconductor filmdoes not peel from the substrate after heating is less than +50 N/m,preferably less than or equal to +28 N/m.

As shown in FIG. 22, in Samples 11 and 12, a crack formed in thesubstrate and the layer including a semiconductor film. Meanwhile, inSamples 13 to 16, a crack did not form in the substrate and the layerincluding a semiconductor film.

From FIG. 22 and Table 6, it can be seen that when a layer including asemiconductor film which has a total stress after heating of less than+50 N/m, preferably less than or equal to +28 N/m, is formed over anEAGLE2000 substrate (manufactured by Corning, Inc.) with a thermalexpansion coefficient of 31.8×10⁻⁷/° C. and a thickness of 0.7 mm, evenwhen the layer including a semiconductor film is irradiated with a laserbeam, cracks do not form in the substrate and the layer including asemiconductor film.

Further, when the total stress after heating of the layer including asemiconductor film, which is formed over the substrate, is less than−150 N/m, particularly less than −500 N/m, a problem occurs in that thelayer including a semiconductor film peels from the substrate.Therefore, it is desirable that the total stress after heating of thelayer including a semiconductor film, which is formed over thesubstrate, is greater than or equal to −500 N/m, preferably greater thanor equal to −150 N/m.

When a layer including a semiconductor film which has a total stressafter heating of greater than or equal to −500 N/m and less than 0 N/m,preferably greater than or equal to −150 N/m and less than or equal to−16 N/m, is formed over an AN100 substrate (manufactured by Asahi GlassCo., Ltd) with a thermal expansion coefficient of 38×10⁻⁷/° C. and athickness of 0.7 mm, and subsequently the layer is irradiated with alaser beam, the number of cracks that form in the substrate and thelayer including a semiconductor film can be reduced.

Further, it can be seen that when a layer including a semiconductorfilm, which has a total stress after heating of greater than or equal to−500 N/m and less than +50 N/m, preferably greater than or equal to −150N/m and less than or equal to +28 N/m, is formed over an EAGLE2000substrate (manufactured by Corning, Inc.) with a thermal expansioncoefficient of 31.8×10⁻⁷/° C. and a thickness of 0.7 mm, even when thelayer including a semiconductor film is irradiated with a laser beam,cracks do not form in the substrate and the layer including asemiconductor film.

Therefore, when a layer including a semiconductor film, which has atotal stress after heating of −500 N/m to +50 N/m, inclusive, preferably−150 N/m to 0 N/m, inclusive, is formed over a substrate having athermal expansion coefficient of greater than 6×10⁻⁷/° C. and less thanor equal to 38×10⁻⁷/° C., preferably greater than 6×10⁻⁷/° C. and lessthan or equal to 31.8×10⁻⁷/° C., and subsequently the layer isirradiated with a laser beam, the number of cracks that form in thesubstrate and the layer including a semiconductor film can be reduced.

Embodiment 2

In this embodiment, the stress of a layer including an amorphoussemiconductor film, which is formed over a substrate, after the layerhas been heated (experimental value), and the number of cracks thatformed when the amorphous semiconductor film was irradiated with a laserbeam will be described with reference to FIG. 23.

A layer including an amorphous semiconductor film was formed over asubstrate. Here, an AN100 substrate with a thermal expansion coefficientof 38×10⁻⁷/° C. and a thickness of 0.7 mm was used as the substrate.

For Samples 21-1 to 21-3, a silicon nitride oxide film with a thicknessof 50 nm, a silicon oxynitride film with a thickness of 100 nm, and anamorphous silicon film with a thickness of 66 nm were formed in thatorder over the substrate as the layer including a semiconductor film.

For Samples 22-1 to 22-3, a silicon nitride oxide film with a thicknessof 50 nm, a silicon oxynitride film with a thickness of 100 nm, and anamorphous silicon film with a thickness of 66 nm were formed in thatorder over the substrate as the layer including a semiconductor film.

For Samples 23-1 to 23-3, a silicon oxynitride film with a thickness of100 nm and an amorphous silicon film with a thickness of 66 nm wereformed over the substrate in that order as the layer including asemiconductor film.

Film formation conditions for each of the films included in the layersincluding a semiconductor film in Samples 21-1 to 21-3, Samples 22-1 to22-3, and Samples 23-1 to 23-3 are shown in Table 7.

[Table 7]

Next, Samples 21-1 to 21-3 were heated in a furnace at 500° C. for onehour and then at 550° C. for four hours, to dehydrogenate the amorphoussemiconductor film.

The number of cracks that formed in Sample 21-1, Sample 22-1, and Sample23-1 after they were irradiated with a laser beam is shown in FIG. 24.The number of cracks at this time in the substrate upper end portion,the substrate center portion, the substrate lower end portion, 1 cminside the substrate upper end, and 1 cm inside the substrate lower endare each shown.

Irradiating conditions of the laser beam at this time were a secondharmonic of an Nd:YVO₄ laser, a scanning speed of 35 cm/sec, and a powerof 18 W.

From FIG. 23, it can be seen that the total stress after heating of thelayer including a semiconductor film in Samples 21-1 to 21-3 is tensilestress. Note that since the total stress of Sample 21-1 was tensilestress with a value of greater than 100, it is not plotted in the graphin FIG. 23. The total stress after heating of the layer including asemiconductor film in Samples 22-1 to 22-3 is approximately zero. Thetotal stress after heating of the layer including a semiconductor filmin Samples 23-1 to 23-3 is compressive stress, which is lower than zero.

Note that in this embodiment, AN100 substrates were used as substrates.Further, for Samples 21-1 to 21-3, the same film formation conditions asthose for Sample 2 in Embodiment 1 were used; for Samples 22-1 to 22-3,the same film formation conditions as those for Sample 3 in Embodiment 1were used; and for Samples 23-1 to 23-3, the same film formationconditions as those for Sample 10 in Embodiment 1 were used.

For Sample 2, Sample 3 and Sample 10 of Embodiment 1, each film in thelayer including a semiconductor film, which was formed over a substrate,was formed over a separate silicon substrate and then heated, and thetotal stress of the layer including a semiconductor film was calculatedby adding together the products of the film stresses and the filmthicknesses. Meanwhile, for each sample in this embodiment, an AN100substrate was used as a substrate. When an AN100 substrate is heated at550° C., a certain amount of compressive stress is generated. Therefore,for the samples in Embodiment 2, the total stress of the layers formedover the substrates also shifted toward the compressive stress sidesomewhat, compared with their corresponding samples in Embodiment 1.

From FIG. 24, it can be seen that Sample 22-1, that is, the sample inwhich the total stress of the layer including a semiconductor film afterheating was approximately zero, has a lower number of cracks comparedwith Sample 21-1, that is, the sample in which the total stress of thelayer including a semiconductor film after heating was tensile stress.

Further, it can be seen that Sample 23-1, that is, the sample in whichthe total stress of the layer including a semiconductor film afterheating was compressive stress which was lower than approximately zero,has a lower number of cracks compared with Sample 22-1, that is, thesample in which the total stress of the layer including a semiconductorfilm after heating was approximately zero.

That is, when the total stress of a layer including an amorphous siliconfilm, which is formed over a substrate, after it has been heated is lessthan or equal to 0 N/m, the number of cracks in the substrate can bereduced. Further, it can be seen that the formation of cracks in thecenter of the substrate can be prevented. That is, when the total stressof a layer including an amorphous silicon film, which is formed over asubstrate, after it has been heated is less than or equal to 50 N/m,preferably less than or equal to 0 N/m, the formation of cracks in thecenter of the substrate can be prevented.

Note that the reason that the number of cracks in the substrate upperend portion and the substrate lower end portion is higher compared withthe number of cracks in the substrate center portion, the number ofcracks in the area 1 cm inside the substrate upper end, and the numberof cracks in the area 1 cm inside the substrate lower end in FIG. 24 isthat tensile stress concentrates in flaws in the substrate ends, socracks progress easily therein.

Accordingly, when a layer including a semiconductor film, which has atotal stress after being heated of −500 N/m to +50 N/m, inclusive,preferably −150 N/m to 0 N/m, inclusive, is formed over a substratehaving a thermal expansion coefficient of greater than 6×10⁻⁷/° C. andless than or equal to 38×10⁻⁷/° C., preferably greater than 6×10⁻⁷/° C.and less than or equal to 31.8×10⁻⁷/° C., and subsequently the layer isirradiated with a laser beam, the number of cracks that form in thesubstrate and the layer including a semiconductor film can be reduced.Further, the formation of cracks in the substrate center can beprevented.

This application is based on Japanese Patent Application serial no.2006-199241 filed in Japan Patent Office on 21 Jul. 2006, the entirecontents of which are hereby incorporated by reference.

1. A method of manufacturing a semiconductor device comprising the stepsof: forming a layer including a semiconductor film over a glasssubstrate; heating the layer including the semiconductor film; andirradiating the heated layer including the semiconductor film with alaser beam, wherein a thermal expansion coefficient of the glasssubstrate is 6×10⁻⁷/° C. to 38×10⁻⁷/° C., and wherein total stress ofthe layer including the semiconductor film is −500 N/m to +50 N/m afterthe heating step and before the irradiating step.
 2. The method ofmanufacturing a semiconductor device according to claim 1, wherein thelaser beam is a continuous wave laser beam.
 3. The method ofmanufacturing a semiconductor device according to claim 1, wherein thelaser beam has a repetition rate of 10 MHz or more.
 4. An electronicapparatus having the semiconductor device according to claim
 1. 5. Theelectronic apparatus according to claim 4, wherein the electronicapparatus is a portable information terminal, a digital video camera, aportable terminal, a portable television device, a portable computer, ora television device.
 6. A method of manufacturing a semiconductor devicecomprising the steps of: forming a layer including a semiconductor filmover a glass substrate; heating the layer including the semiconductorfilm; and irradiating the heated layer including the semiconductor filmwith a laser beam, wherein a thermal expansion coefficient of the glasssubstrate is 6×10⁻⁷/° C. to 38×10⁻⁷/° C., wherein total stress of thelayer including the semiconductor film is −500 N/m to +50 N/m after theheating step and before the irradiating step, and wherein the layerincluding the semiconductor film is formed by stacking a silicon nitrideoxide film, a silicon oxynitride film, and an amorphous semiconductorfilm in that order over the substrate.
 7. The method of manufacturing asemiconductor device according to claim 6, wherein the laser beam is acontinuous wave laser beam.
 8. The method of manufacturing asemiconductor device according to claim 6, wherein the laser beam has arepetition rate of 10 MHz or more.
 9. An electronic apparatus having thesemiconductor device according to claim
 6. 10. The electronic apparatusaccording to claim 9, wherein the electronic apparatus is a portableinformation terminal, a digital video camera, a portable terminal, aportable television device, a portable computer, or a television device.11. A method of manufacturing a semiconductor device comprising thesteps of: forming a layer including a semiconductor film over a glasssubstrate; heating the layer including the semiconductor film; andirradiating the heated layer including the semiconductor film with alaser beam, wherein a thermal expansion coefficient of the glasssubstrate is 6×10⁻⁷/° C. to 38×10⁻⁷/° C., wherein total stress of thelayer including the semiconductor film is −500 N/m to +50 N/m after theheating step and before the irradiating step, and wherein the layerincluding the semiconductor film is formed by stacking a siliconoxynitride film and an amorphous semiconductor film in that order overthe substrate.
 12. The method of manufacturing a semiconductor deviceaccording to claim 11, wherein the laser beam is a continuous wave laserbeam.
 13. The method of manufacturing a semiconductor device accordingto claim 11, wherein the laser beam has a repetition rate of 10 MHz ormore.
 14. An electronic apparatus having the semiconductor deviceaccording to claim
 11. 15. The electronic apparatus according to claim14, wherein the electronic apparatus is a portable information terminal,a digital video camera, a portable terminal, a portable televisiondevice, a portable computer, or a television device.
 16. A method ofmanufacturing a semiconductor device comprising the steps of: forming asilicon nitride oxide film over a glass substrate; forming a siliconoxynitride film over the silicon nitride oxide film; forming anamorphous semiconductor film over the silicon oxynitride film; heatingthe silicon nitride oxide film, the silicon oxynitride film, and theamorphous semiconductor film; and irradiating the silicon nitride oxidefilm, the silicon oxynitride film, and the amorphous semiconductor filmwith a laser beam, wherein the glass substrate has a thermal expansioncoefficient of 38×10⁻⁷/° C. and a thickness from 0.5 to 1.2 mm, whereintotal stress of the silicon nitride oxide film, the silicon oxynitridefilm, and the amorphous semiconductor film is −500 N/m to −16 N/m afterthe heating step and before the irradiating step, wherein thicknesses ofthe silicon nitride oxide film, the silicon oxynitride film, and theamorphous semiconductor film are 40 to 60 nm, 80 to 120 nm, and 50 to 80nm, respectively, and wherein the silicon nitride oxide film, thesilicon oxynitride film, and the amorphous semiconductor film are formedby a plasma CVD method.
 17. The method of manufacturing a semiconductordevice according to claim 16, wherein the laser beam is a continuouswave laser beam.
 18. The method of manufacturing a semiconductor deviceaccording to claim 16, wherein the laser beam has a repetition rate of10 MHz or more.
 19. An electronic apparatus having the semiconductordevice according to claim
 16. 20. The electronic apparatus according toclaim 19, wherein the electronic apparatus is a portable informationterminal, a digital video camera, a portable terminal, a portabletelevision device, a portable computer, or a television device.
 21. Amethod of manufacturing a semiconductor device comprising the steps of:forming a silicon nitride oxide film over a glass substrate; forming asilicon oxynitride film over the silicon nitride oxide film; forming anamorphous semiconductor film over the silicon oxynitride film; heatingthe silicon nitride oxide film, the silicon oxynitride film, and theamorphous semiconductor film; and irradiating the silicon nitride oxidefilm, the silicon oxynitride film, and the amorphous semiconductor filmwith a laser beam, wherein the glass substrate has a thermal expansioncoefficient of 31.8×10⁻⁷/° C. and a thickness from 0.5 to 1.2 mm,wherein total stress of the silicon nitride oxide film, the siliconoxynitride film, and the amorphous semiconductor film is −500 N/m to +28N/m after the heating step and before the irradiating step, whereinthicknesses of the silicon nitride oxide film, the silicon oxynitridefilm, and the amorphous semiconductor film are 40 to 60 nm, 80 to 120nm, and 50 to 80 nm, respectively, and wherein the silicon nitride oxidefilm, the silicon oxynitride film, and the amorphous semiconductor filmare formed by a plasma CVD method.
 22. The method of manufacturing asemiconductor device according to claim 21, wherein the laser beam is acontinuous wave laser beam.
 23. The method of manufacturing asemiconductor device according to claim 21, wherein the laser beam has arepetition rate of 10 MHz or more.
 24. An electronic apparatus havingthe semiconductor device according to claim
 21. 25. The electronicapparatus according to claim 24, wherein the electronic apparatus is aportable information terminal, a digital video camera, a portableterminal, a portable television device, a portable computer, or atelevision device.